Highly accurate flipchip bonding for transceiver applications

bonding

There are highest demands on accuracy of bonding flipchips e.g. on glass substrates to achieve maximum coupling efficiency, which are a challenge likewise for the machine supplier and the process developer. This presentation focuses on machine solutions to provide best possible machine capability but also points towards important aspects to turn this into an appropriate process capability. The FINEPLACER® principle is explained and how this is improved to reach a placement accuracy of 0.3 µm @ 3s.

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