Photonic multi-domain integration trends

stefan mohrdiek

Unlike mainly silicon-based electronics, photonic integration is characterized on one hand by a large diversity of material platforms used (Si, SiN, InP, GaAs, polymers) and on the other hand by wavelengths ranging from UV to the far infrared. In view of the difficulties to establish common, standardized platforms, heterogeneous integration continues to be a key element to drive new technologies and scientific advances for the next decade. The combination of heterogeneous functionalities with optical, thermal, electrical, fluidic, mechanical, and high frequency characteristics requires specialized materials and system integration (packaging and assembly) processes and equipment.

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“JePPIX: Generic Foundry for InP and SiN Photonic Integrated Circuits” – Presented by Valentina Moskalenko, JePPIX

“JePPIX: Generic Foundry for InP and SiN Photonic Integrated Circuits” – Presented by Valentina Moskalenko, JePPIX, at Photonic Integration Conference, Sep 27, 2016, at High Tech Campus Eindhoven, The Netherlands.

The presentation will introduce generic integration platform offered by JePPIX. We will present fabless model which allows to reduce the entry costs of a PIC prototype via participation in multiproject wafer runs down to a level that is affordable for many SMEs and universities. The talk will be focused on design process cycle and possibilities provided by InP and SiN generic platforms. Continue reading ““JePPIX: Generic Foundry for InP and SiN Photonic Integrated Circuits” – Presented by Valentina Moskalenko, JePPIX”