Advances in GaAs and GaSb optoelectronics for heterogeneous integration with silicon-photonics – Presented by Mircea Guina, Tampere University of Technology, at the Photonic Integration Conference 2018, which will take place on October 2, at High Tech Campus Eindhoven, The Netherlands.
The development of photonic integrated circuits, which refers broadly to a technology platform that allows the combination of different optical components, has recently progressed as a fast pace pushed by vigorous advances of Si-based circuit technology. However, major advances are still needed to enable more practical and scalable manufacturing approaches for integration of III-V light sources and other optoelectronics components on Si. This trend is accelerated by transition of Si-photonics technology to application outside telecomm and datacomm area, for example towards mid-IR wavelength range to serve needs in sensing and life-science applications.
With this perspective, the latest advances in developing GaAs- and GaSb-based light sources for heterogenouse integration with Si photonics circuits are reviewed. In terms of integration platform we address hybrid and novel monolithic approaches. Specific applications discussed include un-cooled operation of transceivers at 1.2 -1.3 µm window and integrated programmable light sources for sensing at 2-3 µm window. Continue reading “Advances in GaAs and GaSb optoelectronics for heterogeneous integration with silicon-photonics – Presented by Mircea Guina, Tampere University of Technology”
Silicon photonics in 3 µm SOI – Presented by Timo Aalto, VTT, at the Photonic Integration Conference 2018, which will take place on October 2, at High Tech Campus Eindhoven, The Netherlands.
Latest progress in the development of silicon photonics on VTT’s 3 µm SOI platform is presented. This includes active and passive components, as well as broadband I/O coupling solutions. Also some hybrid integration of III-V optoelectronics on SOI is presented. Continue reading “Silicon photonics in 3 µm SOI – Presented by Timo Aalto, VTT”
“With a bit of luck and cooperation of the major stakeholders in the public market, we will have in about two years time faster internet connections”, according to professor John Marsh. But the far east will be the first to enjoy this advantage, as they have invested heavily in fibre optic systems over the past decade rather than relying on old copper networks like Europe and North America. On top of that it is of immense importance that the leading access network companies in the world agree on standards that include a robust roadmap for the next 15 years. Continue reading “Photonic integration in the future access market – Interview with Professor John Marsh, University of Glasgow”
Mentor Tanner EDA and Luceda is Silver Partner of Photonic Integration Conference, which will take place on September 27, 2016, at High Tech Campus Eindhoven, The Netherlands. Continue reading “Photonic Integration Conference Welcomes Mentor Tanner EDA and Luceda as Silver Partner”
With network traffic in data centers doubling every 12 months, electrons running over copper cable just won’t cut it. Continue reading “Intel launches silicon photonics for data centers”
Silicon photonics holds the potential to become a cost-effective, scalable technology for the production of photonic integrated circuits (PIC’s) to address applications including high-performance optical networking, data center interconnects, signal processing, and biological and chemical sensing.
Continue reading “PhoeniX Software, INPHOTEC partner to facilitate design and fabrication process of photonic integrated circuits”
World-leading nanoelectronics research center Imec presents at OFC 2016, the international event for both the science and business of optical communications held March 20-24, performance improvements of various key building blocks of its wafer-scale integrated silicon photonics platform (iSiPP). The new results expand imec’s iSiPP device portfolio to support 50Gb/s non-return-to-zero (NRZ) lane rates, and are an important milestone for the realization of high data rate silicon integrated optical interconnects targeting high density, high bandwidth, low power telecom and datacom transceivers, as well as for low cost large volume applications such as sensors or LiDAR. Continue reading “Imec Announces Performance Improvements of its Wafer-Scale Integrated Silicon Photonics Platform”
Recent progresses in the fields of silicon photonics, graphene photonics, nanoplasmonics are reviewed with some research highlights on wavelength/mode (de)multiplexing devices, optical switches, micro-cavities and transparent electrodes, etc. Besides photonic integration research in Mainland China, some national and international research fundings/programs supported by the government of China will also be discussed.
About Sailing He Continue reading “"Photonic integration developments in China" – Presented by Sailing He, Zhejiang University”
Leti and Partners in Silicon Photonics Supply-Chain Project Announce Developments on Three Mature Platforms Continue reading “PLAT4M Project Focused on Speeding Industrialization of the Technology”
Researchers have taken key steps towards building a European-based silicon photonics supply chain and speeding up industrialisation of the technology.
Partners involved in the EU-funded PLAT4M project have developed new technologies to achieve the mass production of silicon photonics, which can be used to build complementary metal–oxide–semiconductor (CMOS) circuits. Continue reading “Researchers have taken key steps towards building a European-based silicon photonics supply chain”