Advanced packaging of integrated photonic devices based on semiconductor assembly methods. The presentation describes methods for high density flip chip IO, approaches for improved RF performance and assembly packaging in large volumes.Continue reading “Advanced packaging and assembly of Integrated Photonic devices”
Presentation by Carol de Vries, Technology and System consultant at PhotonDelta
The automotive industry is going through unprecedented changes, driven by 3 mega trends that are happening in the same timeframe. These are electrification, the drive towards autonomous vehicles & driver support systems, and the change in mobility patterns and city infrastructure.Continue reading “Megatrends in the automotive & mobility sector and the role of integrated photonics”
BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG, at the Photonic Integration Conference 2017, which will take place on September 26, at High Tech Campus Eindhoven, The Netherlands.
BRIDG – Open Innovation Platform to Advance the Commercialization of Revolutionary New Semiconductor-Based Products
- BRIDG is the first public-private partnership focus on the integration of advanced materials and processes for the manufacturing scale-up of next generation sensors, imagers, and advanced devices / systems. This open innovation platform will provide design, process, packaging, and prototyping solutions for private and collaborative industry based programs – positioned to support a broad base of industry sectors (e.g., Aerospace and Defense, Life Sciences, Food and Agriculture, Robotics and Autonomous Systems, IoT,…)
BRIDG initial Technology Platforms:
- 3-D and III-V Photonics
- GaN sensor, imager, and RF devices
- Heterogenous Integration (2.5 / 3-D) of Si, III-V and Opto-Electronics
- Private industry programs that leverage BRIDG infrastructure, expertise, and network
The BRIDG Public-Private partnership leverages funding and expertise from governments, universities, and industry – a model that accelerates commercialization and provides cost-effective solutions for SMEs and large companies facing complex product development challenges – “valley-of-death”. Continue reading “BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG”
SEMI is Media Partner of Photonic Integration Conference, which will take place on Sep 27, 2016, at High Tech Campus in Eindhoven, The Netherlands. Continue reading “SEMI is Media Partner of Photonic Integration Conference”
Moore’s Law, the 1965 observation by Fairchild and Intel co-founder Gordon Moore that the number of transistors on an integrated circuit doubles about every two years, is set for repeal by 2021.
The Semiconductor Industry Association’s (SIA) latest International Technology Roadmap (PDF) suggests that it will be all-change as early as 2021. Continue reading “Semiconductors reaching practical limits, says SIA”
The recently launched Juncker Investment Package by the European Commission means €315 billion over the next three years will be set aside to establish strategic innovation hubs to boost Europe’s future growth. The re-industrialization of the European economy has become a major priority. There’s now a clear focus of funds on technologies that generate business. Continue reading “Why Europe cares about the exponential success of Photonics”