New pilot line to be incubator of photonics multinationals in Eindhoven
Photonics is an emerging technology with a potential multitrillion market. Innovative small and medium sized enterprises (SMEs) are at the forefront of this development, but the R&D costs are prohibitive for them. That’s why 12 partners from northwestern Europe are creating an open access pilot line that will drastically reduce costs and time for the pilot production of new products. This new facility is projected to be the incubator of a thousand new companies and thousands of jobs. The 14 million euro project (OIP4NWE) is supported by the European Regional Development Fund and kicked off this week in Eindhoven. Continue reading “New pilot line to be incubator of photonics multinationals in Eindhoven”
Scale-up of packaging for integrated photonic devices – Presented by Prof. Peter O’Brien, PIXAPP , at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.
There has been much activity focused on the development of PIC chip. However, an packaging bottleneck exists blocking users from commercialising full system solutions. In my talk, I will present an overview of assembly and packaging technologies for a range of PIC devices, including Silicon, InP and SiN materials. I will also present how packaging design rules are important to ensure cost-effective solutions. Finally, I will present details of the European Pilot Line (PIXAPP), which is developing a range of standardised optical and electrical packaging technologies, with the objective of addressing scale-up to large volume packaging.
Continue reading “Scale-up of packaging for integrated photonic devices – Presented by Prof. Peter O’Brien, PIXAPP”
Presented by Sergio Nicoletti, CEA – Leti, at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.
This talk will discuss the challenges of spectroscopy and chemical sensing with a focus on the miniaturization and the co-integration of photonics devices at chip and packaging level to address cost, size and power consumption. This approach is now pursued by the MIRPHAB Pilot Line which is offering access for fast prototyping and series fabrication of sensing devices.
Continue reading “New trends in optical chemical sensing: the MIRPHAB approach”