Addressing the high cost of photonic test and assembly through technology and partnerships

cost

Since the first laser diodes and single-mode optical fibers of the early 1990s, the high cost and labor-intensiveness of testing and assembling photonic components have impacted production economics and impeded scaling. With the advent of Silicon Photonics and today’s complex, multi-channel devices, and anticipating adoption of photonics into major new applications fields outside the data center, the newest approaches to improving manufacturing efficiency and yield are seeing high demand.

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Future photonic chip modules will look a lot like todays electronic chip packages

moderator

except for a small shiny area on the surface..

Peter Harmsma, program manager at CITC will be the moderator of the 2021 edition of the Photonic Integration Conference. Peter has a background in integrated photonics. He is a senior scientist at TNO with special interest in photonic sensing, and currently acts as program manager photonic packaging at CITC.

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Chip Integration Technology Center Becomes Partner of Photonic Integration Conference

Chip Integration Technology Center

Chip Integration Technology Center (CITC) becomes partner of the Photonic Integration Conference 2021

CITC is a non-profit joint innovation center that specializes in heterogeneous integration and advanced chip packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.

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Photonics in a Systems Context

Gerrit Muller

by Gerrit Muller, TNO-ESI

Photonics is a specific set of technologies with many real world applications. Users operate these applications using various systems that in turn deploy a wide variety of technologies. In this presentation we will zoom in from application perspective to photonic technology and zoom out to application to see the change in perspective with every step that we make. Fitness for purpose requires that each aggregation level meets its key performance parameters and functionality.

program: https://www.phiconference.com/program/

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The Integrated Photonics Systems Roadmap – International (IPSR-I) 2020 is available now

ipsr-i 2020

The roadmap is a joint initiative of the AIM Academy and PhotonDelta, with the objective to establish and sustain a trust based global network of industrial and R&D partners, who are working together on defining and creating future PIC technology and systems requirements. Continue reading “The Integrated Photonics Systems Roadmap – International (IPSR-I) 2020 is available now”

Engineering and Regulatory Pathways for Designing Lenses and Light Pipes for PICs in Wearable Medical Devices

Shourjya Sanyal

by Dr. Shourjya Sanyal, CEO, Think Biosolution

Optical elements such as light-pipes and lenses allow physical coupling of the PICs with the external environment. Optimal design is a critical part of the design for manufacturing (DFM) process and can deliver impact in terms of increasing both brightness of the source and signal to noise ratio of the optical sensor. One of the biggest challenges in photonic integrated circuits (PICs) is to design a system that continues interacting with the external environment without a loss of quality over time.

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