Duo presentation by Marinus J. van der Hoek, Director / Photonics Innovator, VanderHoekPhotonics and Ruben van Ardenne, Manager Strategy and Innovation, Compass Infrastructure, The Netherlands
Photonics-based telecoms has accelerated the development and application of photonics-based sensing to a great extent. Nowadays, challenging conditions for sensing can be met using innovative principles, enabled by the nature of light.
From an industrial point of view, we are convinced photonics based sensing is the way forward and collaboration in the whole Photonics-based ecosystem is key.
Continue reading “Photonic Integration: A key enabler for multi-measure and sensing in complex Infrastructure”
“With a bit of luck and cooperation of the major stakeholders in the public market, we will have in about two years time faster internet connections”, according to professor John Marsh. But the far east will be the first to enjoy this advantage, as they have invested heavily in fibre optic systems over the past decade rather than relying on old copper networks like Europe and North America. On top of that it is of immense importance that the leading access network companies in the world agree on standards that include a robust roadmap for the next 15 years. Continue reading “Photonic integration in the future access market – Interview with Professor John Marsh, University of Glasgow”
Photonic Integration Conference 2017 welcomes Haptic.ro as Media Partner
HAPTIC R&D CONSULTING is a consulting of global technology and engineering company providing innovative solutions for customers in industrial, commercial, and residential markets. Our goal is your target in a future visionary way to create a synergy business bridge between SME’s companies and R&D laboratories to merge together in revolutionary and innovation projects.
HAPTIC R&D CONSULTING stays focussed both on private and public organisations, NGOs, universities, educational institutes and agencies offering various services related to European funded programmes such as Horizon 2020 helping them to access EU funds.
For more info please visit our website www.haptic.ro or contact us: email@example.com
About Photonic Integration Conference 2017
On September 26, 2017, the 3rd edition of the Photonic Integration Conference will take place at High Tech Campus Eindhoven, The Netherlands. Continue reading “Photonic Integration Conference 2017 welcomes Haptic.ro as Media Partner”
Status of AIM Photonics – Presented by Michael Liehr, AIM Photonics, at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.
The American Institute for Manufacturing Photonics (AIM Photonics) is a manufacturing consortium headquartered in NY, with funding from the US Department of Defense, New York State, California and Massachusetts, and industrial partners to advance the state of the art in the design, manufacture, testing, assembly, and packaging of integrated photonic devices. Dr. Michael Liehr, CEO of AIM Photonics, will describe the technical goals, operational framework, milestones, and opportunities for the broader photonics community.
About Michael Liehr
Michael Liehr is the Chief Executive Officer of the American Institute for Manufacturing (AIM) of Integrated Photonics and the SUNY Poly Executive Vice President for Technology and Innovation. Prior to this assignment, he led the Global 450mm Consortium as the General Manager and was an IBM Distinguished Engineer. Continue reading “Status of AIM Photonics – Presented by Michael Liehr, AIM Photonics”
Application examples of TriPleX based PIC modules & Pix4life silicon nitride open access ecosystem – Presented by Arne Leinse, LioniX International, at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.
Application examples of silicon nitride (TriPleX) based PIC modules and the Pix4life silicon nitride open access ecosystem
Application examples of the silicon nitride based PIC platform (TriPleX) will be shown and the accessibility of the ecosystem of silicon nitride based waveguide technology in Europe will be discussed in more detail. The H2020 Pix4life pilot line will be explained and the different technologies available for external users will be highlighted showing the audience the route forward for accessing these PIC platforms allowing them to easily develop new application modules.
About Arne Leinse
Arne Leinse Ph.D (Chief Commercial Officer) is active in integrated optics for more than 15 years. He received a PhD degree from the University of Twente in the integrated Optical Microsystems group in 2005. Hereafter he joined LioniX BV where he was involved in the invention and development of the TriPleX™ platform from the beginning. He has been involved from the original concept until the exploitation and (co)authored over 100 articles in the last years. He has been active as Vice-President of LioniX BV in the last years and since the establishment of LioniX-international in 2016 active in the role of Chief Commercial Officer. Continue reading “Application examples of TriPleX based PIC modules & Pix4life silicon nitride open access ecosystem – Presented by Arne Leinse, LioniX International”
BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG, at the Photonic Integration Conference 2017, which will take place on September 26, at High Tech Campus Eindhoven, The Netherlands.
BRIDG – Open Innovation Platform to Advance the Commercialization of Revolutionary New Semiconductor-Based Products
- BRIDG is the first public-private partnership focus on the integration of advanced materials and processes for the manufacturing scale-up of next generation sensors, imagers, and advanced devices / systems. This open innovation platform will provide design, process, packaging, and prototyping solutions for private and collaborative industry based programs – positioned to support a broad base of industry sectors (e.g., Aerospace and Defense, Life Sciences, Food and Agriculture, Robotics and Autonomous Systems, IoT,…)
BRIDG initial Technology Platforms:
- 3-D and III-V Photonics
- GaN sensor, imager, and RF devices
- Heterogenous Integration (2.5 / 3-D) of Si, III-V and Opto-Electronics
- Private industry programs that leverage BRIDG infrastructure, expertise, and network
The BRIDG Public-Private partnership leverages funding and expertise from governments, universities, and industry – a model that accelerates commercialization and provides cost-effective solutions for SMEs and large companies facing complex product development challenges – “valley-of-death”. Continue reading “BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG”
Photonic Integration Conference 2017 welcomes EPIC as Media Partner
EPIC is the industry association in the field of photonics and publishes market and technology reports, organizes technical workshops and B2B roundtables, international delegations, engages in advocacy and lobbying, European funded projects, finance and investment, education and training activities, standards and roadmaps.
About Photonic Integration Conference 2017
On September 26, 2017, the 3rd edition of the Photonic Integration Conference will take place at High Tech Campus Eindhoven, The Netherlands. Continue reading “Photonic Integration Conference 2017 welcomes EPIC as Media Partner”
“Managing the data explosion: the future of data centers” – presented by Stijn Grove, Managing Director, Dutch Datacenter Association, at Photonic Integration Conference, Sep 27, 2016, High Tech Campus Eindhoven, The Netherlands.
An overview of the trends, fact & figures of data growth from a data center perspective. Continue reading ““Managing the data explosion: the future of data centers” – Stijn Grove, Dutch Datacenter Association”
VPIphotonics is Bronze partner of Photonic Integration Conference, which will take place on September 27, 2016, at High Tech Campus Eindhoven, The Netherlands.
Continue reading “Photonic Integration Conference Welcomes VPIphotonics as Bronze Partner”
It’s tough being a data center these days. Demand for bandwidth is exploding. Every second, two households are connected to the Internet, and the amount of data doubles for each connection every 18 months. In 2016, over a billion smartphones will be sold worldwide, and each device needs access to a data center.
Silicon Valley, we have a problem. Continue reading “There’s a ‘light on a chip’ revolution coming and Europe is in the lead”