Photonic Integration Conference 2017 welcomes PIC International magazine as Media Partner

PIC Magazine

Photonic Integration Conference 2017 welcomes PIC Magazine as Media Partner

About PIC International magazine

, simulation, fabrication, testing, packaging and measurement of photonic integrated circuits, including a ‘deep dive’ into the various materials platforms from today’s InP technology through to challenges from silicon photonics and polymer systems. Beyond that, the title will highlight research breakthroughs with commercial potential and examine customer requirements.
The publication brings together suppliers, designers and manufacturers across the PIC ecosystem from development through to application, providing a forum for the community to share opinions on the challenges ahead, roadmap progress and open up new markets.

About Photonic Integration Conference 2017

On September 26, 2017, the 3rd edition of the Photonic Integration Conference will take place at High Tech Campus Eindhoven, The Netherlands. Continue reading “Photonic Integration Conference 2017 welcomes PIC International magazine as Media Partner”

“PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap

“PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap, at Photonic Integration Conference, Sep 27, 2016, High Tech Campus Eindhoven, The Netherlands.

A review of the possibilities for PIC packaging & what to consider for when assessing the needs of your PIC prototype package platform.

Advice on how to navigate the package development stepping stones to get your product into production. Continue reading ““PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap”