Electro-Optic Circuit Boards – an advanced photonic chip packaging platform

nikolaus flöry

Photonic integrated circuits are playing a key role in various next generation sensing and telecommunication applications. Packaging of such chips has become the bottleneck of their integration and deployment. A novel platform based on poylmer waveguides integrated with electrical PCBs is presented, which allows to simultaneously interface photonic chips electrically and optically at high port-densities. Design rules and examples of this novel chip-packaging platform are discussed and showcased.

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The Integrated Photonics Systems Roadmap – International (IPSR-I) 2020 is available now

ipsr-i 2020

The roadmap is a joint initiative of the AIM Academy and PhotonDelta, with the objective to establish and sustain a trust based global network of industrial and R&D partners, who are working together on defining and creating future PIC technology and systems requirements. Continue reading “The Integrated Photonics Systems Roadmap – International (IPSR-I) 2020 is available now”

“Evolution of Photonic Design Services” – Presented by Katrin Rylander, Bright Photonics

Katrin Rylander

“Evolution of Photonic Design Services” – Presented by Katrin Rylander, Bright Photonics, at Photonic Integration Conference, Sep 27, 2016, at High Tech Campus Eindhoven, The Netherlands.

The presentation discusses the development of photonic integrated circuit design services. Continue reading ““Evolution of Photonic Design Services” – Presented by Katrin Rylander, Bright Photonics”

“JePPIX: Generic Foundry for InP and SiN Photonic Integrated Circuits” – Presented by Valentina Moskalenko, JePPIX

“JePPIX: Generic Foundry for InP and SiN Photonic Integrated Circuits” – Presented by Valentina Moskalenko, JePPIX, at Photonic Integration Conference, Sep 27, 2016, at High Tech Campus Eindhoven, The Netherlands.

The presentation will introduce generic integration platform offered by JePPIX. We will present fabless model which allows to reduce the entry costs of a PIC prototype via participation in multiproject wafer runs down to a level that is affordable for many SMEs and universities. The talk will be focused on design process cycle and possibilities provided by InP and SiN generic platforms. Continue reading ““JePPIX: Generic Foundry for InP and SiN Photonic Integrated Circuits” – Presented by Valentina Moskalenko, JePPIX”

“Dos and Don’ts for Commercial Success of PICs” – Presented by Martin Schell, Fraunhofer HHI

commercial success

Generally, PICs solve optical tasks in a much more elegant way than discrete optics. This, however, is no guarantee for commercial success. Some historical examples for commercial success and failures of PICs will be given. A guideline, how to choose the right PIC technology for the right task and volume follows with the intention to help PIC users to minimize upfront development costs and risk.

About Prof. Martin Schell Continue reading ““Dos and Don’ts for Commercial Success of PICs” – Presented by Martin Schell, Fraunhofer HHI”

"The Coming of Age of Photonic Integrated Circuit Technology" – Presented by Michael Wale, Oclaro Technology

Photonic Integrated Circuit (PIC) technology has evolved over more than 30 years to become a key enabler for high-performance optical communications systems, which form the backbone of the internet and thereby underpin our information-intensive world.

PICs can also be an enabler for new and diverse business sectors, including medical, industrial and aerospace applications.

Major progress has been achieved over the last few years in the development of generic platform-based design and manufacturing methods, which will facilitate the use of PICs in new applications and stimulate innovative product design.

The talk will review the current state of the art.

About Prof. Michael J. Wale Continue reading “"The Coming of Age of Photonic Integrated Circuit Technology" – Presented by Michael Wale, Oclaro Technology”