“Photonic Integrated Circuit platforms for Multi Project Wafer access” – Presented by Arne Leinse, LioniX International

“Photonic Integrated Circuit platforms for Multi Project Wafer access” – Presented by Arne Leinse, LioniX International at Photonic Integration Conference, Sep 27, 2016, High Tech Campus Eindhoven, The Netherlands.

In the presentation an overview of the currently available PIC platforms, with easy Multi Project Wafer access, will be given. The state of the art and the Unique Selling Point of each platform will be presented¬† in order to facilitate an easy choice and access for users to the varies platforms. Continue reading ““Photonic Integrated Circuit platforms for Multi Project Wafer access” – Presented by Arne Leinse, LioniX International”