Photonic Integration Conference welcomes Electro Optics as Media Partner

electro optics

Photonic Integration Conference welcomes Electro Optics as Media Partner. The conference takes place on September 29, 2021, during Photonics Applications Week.

About Electro Optics

Electro Optics is the leading resource for engineers involved in photonics business, technology and applications. Registered readers will have access to news of the latest technological developments, trends and opinions in the photonics industry as well as independent, in-depth editorial content. Electro Optics provides uncompromised, informed commentary and analysis on topics of interest to anyone involved in the photonics industry. Published 10 times per year, Electro Optics is available worldwide in print (free for qualified readers) or digital (free to all) formats.

Continue reading “Photonic Integration Conference welcomes Electro Optics as Media Partner”

Photonic Integration Conference welcomes Fibre Systems magazine as Media Partner

fibre systems

Photonic Integration Conference welcomes Fibre Systems magazine as Media Partner

About Fibre Systems

Fibre Systems is a trusted information source for the optical communications industry, aimed at component and subsystem vendors; network equipment manufacturers; planners, installers, and systems integrators; as well as operators and end users of fibre-optic networks worldwide.

Continue reading “Photonic Integration Conference welcomes Fibre Systems magazine as Media Partner”

Photonic integration in product development

Ivana Sersic Vollenbroek

by Ivana Sersic Vollenbroek, DEMCON Advanced Mechatronics BV

DEMCON is a mechatronic system engineering company that focuses on R&D and production of high-tech products and systems. The essentials of systems engineering is integration of a variety of technical disciplines to achieve the best solution for the customer.

For this, open innovation and close collaboration with companies offering new or specific expertise is imperative, such as for example photonics.

Continue reading “Photonic integration in product development”

Hamamatsu Photonics is Silver Partner of Photonic Integration Conference

Hamamatsu

Hamamatsu Photonics Deutschland GmbH will exhibit at Photonic Integration Conference 2019

About Hamamatsu Photonics Deutschland GmbH
Hamamatsu Photonics is a leading manufacturer of devices for the generation and measurement of visible, infrared and ultraviolet light. These devices include photomultipliers, photodiodes, infrared detectors, image sensors, scientific cameras, and light sources.

Continue reading “Hamamatsu Photonics is Silver Partner of Photonic Integration Conference”

Newport is Bronze Partner of Photonic Integration Conference

Newport

Newport will exhibit at Photonic Integration Conference 2019

About Newport
Newport is a brand within the MKS Instruments Light & Motion division.

The Newport product portfolio consists of a full range of solutions including motion control, optical tables and vibration isolation systems, photonics instruments, optics and opto-mechanical components.

Continue reading “Newport is Bronze Partner of Photonic Integration Conference”

Chip Integration Technology Centre (CITC): how Semicon can help Photonics on solving Advanced Packaging challenges – Presented by Barry Peet, BCSEMI NL

Barry Peet program

Chip Integration Technology Centre (CITC): how Semicon can help Photonics on solving Advanced Packaging challenges – Presented by Barry Peet, BCSEMI NL, at the Photonic Integration Conference 2018, which will take place on October 2, at High Tech Campus Eindhoven, The Netherlands.

This presentation will explain the new CITC initiative that is being setup in Nijmegen. Large semicon players (like NXP, Ampleon and Nexperia) combine their knowledge and expertise with Universities like TU Delft and Radboud University to develop new Chip Integration technologies, also in the field of photonics. Continue reading “Chip Integration Technology Centre (CITC): how Semicon can help Photonics on solving Advanced Packaging challenges – Presented by Barry Peet, BCSEMI NL”

The silicon nitride ecosystem and user access via the pilot lines – Presented by Arne Leinse, LioniX International

arne leinse program

The silicon nitride ecosystem and user access via the pilot lines – Presented by Arne Leinse, LioniX International, at the Photonic Integration Conference 2018, which will take place on October 2, at High Tech Campus Eindhoven, The Netherlands.

In the presentation we will discuss the different multi project wafer run offering silicon nitride suppliers and the complementary position of the technology in the Photonic Integrated Circuit (PIC) ecosystem. the different platforms will be shown in more detailed and examples of linkt to the other main photonic platforms will be shown. Continue reading “The silicon nitride ecosystem and user access via the pilot lines – Presented by Arne Leinse, LioniX International”

Advances in GaAs and GaSb optoelectronics for heterogeneous integration with silicon-photonics – Presented by Mircea Guina, Tampere University of Technology

Mircea Guina

Advances in GaAs and GaSb optoelectronics for heterogeneous integration with silicon-photonics – Presented by Mircea Guina, Tampere University of Technology, at the Photonic Integration Conference 2018, which will take place on October 2, at High Tech Campus Eindhoven, The Netherlands.

The development of photonic integrated circuits, which refers broadly to a technology platform that allows the combination of different optical components, has recently progressed as a fast pace pushed by vigorous advances of Si-based circuit technology. However, major advances are still needed to enable more practical and scalable manufacturing approaches for integration of III-V light sources and other optoelectronics components on Si. This trend is accelerated by transition of Si-photonics technology to application outside telecomm and datacomm area, for example towards mid-IR wavelength range to serve needs in sensing and life-science applications.

With this perspective, the latest advances in developing GaAs- and GaSb-based light sources for heterogenouse integration with Si photonics circuits are reviewed. In terms of integration platform we address hybrid and novel monolithic approaches. Specific applications discussed include un-cooled operation of transceivers at 1.2 -1.3 µm window and integrated programmable light sources for sensing at 2-3 µm window. Continue reading “Advances in GaAs and GaSb optoelectronics for heterogeneous integration with silicon-photonics – Presented by Mircea Guina, Tampere University of Technology”