Scale-up of packaging for integrated photonic devices – Presented by Prof. Peter O’Brien, PIXAPP , at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.
There has been much activity focused on the development of PIC chip. However, an packaging bottleneck exists blocking users from commercialising full system solutions. In my talk, I will present an overview of assembly and packaging technologies for a range of PIC devices, including Silicon, InP and SiN materials. I will also present how packaging design rules are important to ensure cost-effective solutions. Finally, I will present details of the European Pilot Line (PIXAPP), which is developing a range of standardised optical and electrical packaging technologies, with the objective of addressing scale-up to large volume packaging.
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