Photonic multi-domain integration trends

stefan mohrdiek

Unlike mainly silicon-based electronics, photonic integration is characterized on one hand by a large diversity of material platforms used (Si, SiN, InP, GaAs, polymers) and on the other hand by wavelengths ranging from UV to the far infrared. In view of the difficulties to establish common, standardized platforms, heterogeneous integration continues to be a key element to drive new technologies and scientific advances for the next decade. The combination of heterogeneous functionalities with optical, thermal, electrical, fluidic, mechanical, and high frequency characteristics requires specialized materials and system integration (packaging and assembly) processes and equipment.

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Future photonic chip modules will look a lot like todays electronic chip packages

moderator

except for a small shiny area on the surface..

Peter Harmsma, program manager at CITC will be the moderator of the 2021 edition of the Photonic Integration Conference. Peter has a background in integrated photonics. He is a senior scientist at TNO with special interest in photonic sensing, and currently acts as program manager photonic packaging at CITC.

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Compression molding technology for packaging of photonic devices – Presented by Huub Claassen, Towa

Huub Claassen

Huub Claassen, Towa, will talk about “Large scale optical and electrical packaging of photonic devices by using transfer and/or compression molding technology. A possibility to reduce cost”, at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.

The traditional technology for chip encapsulation is Transfer Molding. However, with this technology packaging on Wafer level, very thin BGA and large area size MAP substrates was problematic, Therefore Compression Molding has been developed by the TOWA Corporation of Japan. This method can perform resin flow-free molding by using a granular or liquid type of molding compound.

For both transfer and compression molding processes, fully automatic equipment is available.

In this presentation we would like to explain both molding methods in some detail. The packaging of photonic devices with these methods, to reduce cost, should be possible. Continue reading “Compression molding technology for packaging of photonic devices – Presented by Huub Claassen, Towa”

Scale-up of packaging for integrated photonic devices – Presented by Prof. Peter O’Brien, PIXAPP

packaging

Scale-up of packaging for integrated photonic devices – Presented by Prof. Peter O’Brien, PIXAPP , at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.

There has been much activity focused on the development of PIC chip. However, an packaging bottleneck exists blocking users from commercialising full system solutions. In my talk, I will present an overview of assembly and packaging technologies for a range of PIC devices, including Silicon, InP and SiN materials. I will also present how packaging design rules are important to ensure cost-effective solutions. Finally, I will present details of the European Pilot Line (PIXAPP), which is developing a range of standardised optical and electrical packaging technologies, with the objective of addressing scale-up to large volume packaging.
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Interview with Ewit Roos, PhotonDelta, Gold Partner of PHI Conference

ewit roos speaker photonic integration conference

PhotonDelta Managing Director Ewit Roos is one of the keynote speakers at the second Photonics Integration conference. He explained to us that there are three things that need to happen in the year ahead and why this is important; the cooperative, the international roadmap project and the technology centre. Continue reading “Interview with Ewit Roos, PhotonDelta, Gold Partner of PHI Conference”