“PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap

“PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap, at Photonic Integration Conference, Sep 27, 2016, High Tech Campus Eindhoven, The Netherlands.

A review of the possibilities for PIC packaging & what to consider for when assessing the needs of your PIC prototype package platform.

Advice on how to navigate the package development stepping stones to get your product into production. Continue reading ““PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap”