Advanced packaging of integrated photonic devices based on semiconductor assembly methods. The presentation describes methods for high density flip chip IO, approaches for improved RF performance and assembly packaging in large volumes.Continue reading “Advanced packaging and assembly of Integrated Photonic devices”
Presentation by Maarten Buijs, Roadmap and Program Consultant at PhotonDelta.
Rapid and cost-effective diagnostics at the point of care has been pursued for decades, but so far only little progress has been achieved. This became painfully apparent with the outbreak of the Covid-19 pandemic.Continue reading “Integrated photonic biosensors: leading the path to point-of-care diagnostics”
Presentation by Carol de Vries, Technology and System consultant at PhotonDelta
The automotive industry is going through unprecedented changes, driven by 3 mega trends that are happening in the same timeframe. These are electrification, the drive towards autonomous vehicles & driver support systems, and the change in mobility patterns and city infrastructure.Continue reading “Megatrends in the automotive & mobility sector and the role of integrated photonics”
Resonators and Waveguides for Fiber Optics and Integrated Photonics – Presented by Ali Serpenguzel, Koç University, at the Photonic Integration Conference 2018, which will take place on October 2, at High Tech Campus Eindhoven, The Netherlands.
Spherical optical microcavities are the building blocks of three dimensional photonics, as linear optical microcavities are the building blocks of one dimensional photonics. Dielectric and semiconductor based lightwave circuit elements are being integrated into fiber optics and integrated photonics. Silicon microspheres lead themselves to various lightwave circuit element applications such as channel dropping filters, tunable filters, and optical modulators using optical fiber half couplers manufactured from single mode optical fibers. Continue reading “Resonators and Waveguides for Fiber Optics and Integrated Photonics – Presented by Ali Serpenguzel, Koç University”
Towards an end-to-end photonics ecosystem – Interview with Michael Liehr, AIM Photonics
Michael Liehr is the Chief Executive Officer of the American Institute for Manufacturing (AIM) of Integrated Photonics and the SUNY Poly Executive Vice President for Technology and Innovation
The American Institute for Manufacturing Photonics (AIM Photonics) installed by former U.S. President Obama, is a manufacturing consortium headquartered in NY, with funding from the US Department of Defense, New York State, California and Massachusetts, and industrial partners to advance the state of the art in the design, manufacture, testing, assembly, and packaging of integrated photonic devices. “Our mission is to create a national institute supporting the end-to-end integrated photonics manufacturing ecosystem in the U.S. by expanding upon a highly successful public-private partnership model with open-access to world-class shared-use resources and capabilities.
Our emphasis is on overall reduction of manufacturing cost and design complexity to reduce the barrier to entry in this” says Michael Liehr. He focuses on the creation of new semiconductor and related industries business opportunities, and is responsible for the effective and efficient operation of the SUNY Poly industrial programs including SUNY Polytechnic Institute’s strategic 300mm advanced CMOS line, integrated photonic semiconductor and 3D packaging and the 150mm SiC power electronics. Continue reading “Towards an end-to-end photonics ecosystem – Interview with Michael Liehr, AIM Photonics”
It’s tough being a data center these days. Demand for bandwidth is exploding. Every second, two households are connected to the Internet, and the amount of data doubles for each connection every 18 months. In 2016, over a billion smartphones will be sold worldwide, and each device needs access to a data center.
Silicon Valley, we have a problem. Continue reading “There’s a ‘light on a chip’ revolution coming and Europe is in the lead”
TriPleX is a versatile dielectric platform based on alternating Si3N4 and SiO2 layers, fabricated with CMOS compatible equipment. TriPleX waveguides are very low loss over a wide wavelength range (400 nm-2.35 μm) available in several commercialized geometries. The functionality of the TriPleX platform is captured by verified basic building blocks. The corresponding library and associated design kit is available for Multi Project Wafer (MPW) runs. Higher integration levels and hybrid combinations with other commercially available platforms such as InP and SOI is possible through on-chip, low-loss spotsize convertors.
Especially the hybrid combination with InP yields very powerful additional components like integrated small bandwidth lasers, tunable over the whole C-band. Several examples of applications will be provided.
The application of superior technology of integrated photonics has proved to be capable of supporting both new and existing sensing and monitoring solutions for challenging environments and demands. Acting in the frontline with the development of extreme performance in fiber sensing already led to the establishment of worldrecords. From the high performance demands in the high-tech industry to the extreme environmental conditions in space, Technobis is paving roads never walked on before.
Niek Nijenhuis, Marketing Sales Manager, PhoeniX Software, will speak during the Photonic Integration Symposium, providing a general overview (Elevator Pitch) of PhoeniX Software in the Industrial R&D and applications session.
The dream for integrated photonics is to develop on-chip optical components that could eventually replace electronic circuits by offering greater speed, energy efficiency, and potential for miniaturization. Inspired by this goal, many innovative photonics devices are currently being designed, e.g., arrays of micro-scale waveguides to control the propagation of photons on a silicon chip.1–4 Along with these advances, some surprising connections to other areas of physics, such as condensed matter and ultracold atomic gases, have also been discovered. This has ignited the hope that integrated photonics could be useful—not only for applications—but also to cast light on cutting-edge research topics in fundamental science. Continue reading “Four-dimensional integrated photonic devices – New technique to introduce an extra ‘synthetic’ dimension to an array”