Photonic multi-domain integration trends

stefan mohrdiek

Unlike mainly silicon-based electronics, photonic integration is characterized on one hand by a large diversity of material platforms used (Si, SiN, InP, GaAs, polymers) and on the other hand by wavelengths ranging from UV to the far infrared. In view of the difficulties to establish common, standardized platforms, heterogeneous integration continues to be a key element to drive new technologies and scientific advances for the next decade. The combination of heterogeneous functionalities with optical, thermal, electrical, fluidic, mechanical, and high frequency characteristics requires specialized materials and system integration (packaging and assembly) processes and equipment.

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Photonic Integrated Circuits are Enabling Innovative Products

Photonic Integrated Circuits

Photonic Integrated Circuits are Enabling Innovative Products

People from all over the world will be present at the 3rd Annual Photonic Integration Conference which will take place at the High Tech Campus in Eindhoven. One of the keynotes will be by Lightwave Logic CEO Dr. Michael Lebby. His main message: “Photonic Integrated Circuits are Enabling Innovative Products.”

Dr. Lebby will provide an overview of the data communications environment and the latest results of polymer PICs that can scale using 50Gbps modulators for 400Gbps applications. His company, Lightwave Logic, is a technology company focused on the development of Next Generation Photonic Devices and Non-Linear Optical Polymer Materials Systems for applications in high-speed fiber-optic data communications and telecommunications.

The 3rd Annual Photonic Integration Conference is a technical conference that focuses only on PIC based technologies and attracts speakers and companies from all over the world and is attended by senior stakeholders in the integrated photonics value-chain. Continue reading “Photonic Integrated Circuits are Enabling Innovative Products”