The technology for the fabrication of Photonic Integrated Circuits (PICs) has advanced considerably over the past decades. New generations of photonic packages integrate multi-port PICs from different material platforms to provide more functionality and performance. The assembly and packaging of these devices has become the major cost driver in manufacturing.
The most critical step in photonic packaging is the precision alignment (±0.1μm) of the components and waveguides. We propose a concept and designs where MicroElectroMechanical System (MEMS) functionality is integrated with one of the chips in the package to take care of the fine-alignment of flexible waveguide beams.