Highly accurate flipchip bonding for transceiver applications

bonding

There are highest demands on accuracy of bonding flipchips e.g. on glass substrates to achieve maximum coupling efficiency, which are a challenge likewise for the machine supplier and the process developer. This presentation focuses on machine solutions to provide best possible machine capability but also points towards important aspects to turn this into an appropriate process capability. The FINEPLACER® principle is explained and how this is improved to reach a placement accuracy of 0.3 µm @ 3s.

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Finetech is a partner of Photonic Integration Conference

Finetech

Finetech is a partner of Photonic Integration Conference

Finetech is a manufacturer of high-accuracy bonding equipment made in Germany. The bonders are suitable for R&D, lab, and prototype environments, supporting precision applications such as flip chip, laser bars, photonics, VCSELs, MEMS, sensors, chip to wafer, and many more. Automated systems for higher volumes are available Continue reading “Finetech is a partner of Photonic Integration Conference”