Mixed-signal electro-optical automated wafer-level testing for integrated photonics

Ajoscha Schu

by Aljoscha Schu, ficonTEC

While the photonic industry is obviously growing its capacity for producing photonic monolithic integrated circuits with electro-optical characteristics, the testing of these PIC’s seems to be somewhat behind the industrial expectations.
Fully tested or validated chips are required for many safety-related products, but full wafer-level testing or high-speed single chip testing both need further development in the near term.

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