Electro-Optic Circuit Boards – an advanced photonic chip packaging platform

nikolaus flöry

Photonic integrated circuits are playing a key role in various next generation sensing and telecommunication applications. Packaging of such chips has become the bottleneck of their integration and deployment. A novel platform based on poylmer waveguides integrated with electrical PCBs is presented, which allows to simultaneously interface photonic chips electrically and optically at high port-densities. Design rules and examples of this novel chip-packaging platform are discussed and showcased.

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