Light-emitting silicon, breakthrough after 50 years of work

emitting

Emitting light from silicon has been the ‘Holy Grail’ in the microelectronics industry for decades. Solving this puzzle would revolutionize computing, as chips will become faster than ever. Researchers from Eindhoven University of Technology now succeeded: they have developed an alloy with silicon that can emit light. The results have been published in the journal Nature. The team will now start creating a silicon laser to be integrated into current chips.

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Emerging Applications for Photonic Integration Circuits (PIC)

Idelfonso Tafur Monroy

by Idelfonso Tafur Monroy, Professor Terahertz Systems, Eindhoven University of Technology

The goal of the talk is to introduce the merging new area of products and solutions where photonic integration technologies are very well suited such as in agro-food technologies, infrastructural monitoring, THz detection of fake medicines, safe medical scanning and beyond 5G wireless communications.

Thereafter, the talk explains why and how photonic integration is essential for bringing to the mass market these new technologies. Finally, the talk makes a bridge between the research trends, the product development, and the potential and opportunities for the Dutch photonic integration eco-system.

program: https://www.phiconference.com/program/

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"Photonics at TU/e" – Presented by Frank Baaijens, Eindhoven University of Technology

Prof. Dr. Ir. Frank Baaijens, Rector Magnificus, Eindhoven University of Technology, will speak about “Photonics at TU/e” during the Photonic Integration Symposium, which will take place on April 25, at Eindhoven University of Technology, Blauwe Zaal, in Eindhoven, The Netherlands.

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"Exploring the Limits of Photonic Integration" – Presented by Weiming Yao, Eindhoven University of Technology

The steady increase in internet and data center traffic requires new technological solutions that can effectively transport large amount of information at low cost. Photonic integration technology shows great potential to tackle this task as it can combine many components on a single chip and therefore offer high-capacity transmitter and receivers. Like in electronics, parallelism, miniaturization and increasing integration density create new technological challenges that need to be addressed. We present the results from the ELPHI STW project which investigates these new challenges.

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"Process control modules for photonic integrated circuits" – Presented by Dzmitry Pustakhod, Eindhoven University of Technology

Photonic integrated circuits are nowadays available through multi-project wafer runs that are carried out at various foundries. In this novel approach complex photonic ICs are designed using building blocks with guaranteed performance. Process control modules (PCMs) provide foundries the means to test performance parameters of the building blocks and assess the fabrication process. The PROCON STW project has developed a number of such PCMs. In the presentation we will review the results.

About Dzmitry Pustakhod
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"InP membrane on silicon photonic integrated circuits" – Presented by Gunther Roelkens, Eindhoven University of Technology

Progress in the development of InP membrane on silicon photonic integrated circuits will be discussed. This includes the realization of passive optical function, lasers and high-speed photodetectors in an InP membrane platform.

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Meint Smit: Next Steps for InP-based Photonic Integration Technology

Meint Smit

Meint Smit: Next Steps for InP-based Photonic Integration Technology

Indium Phosphide is a versatile semiconductor material that allows for integration of a broad range of components in a single chip. Basic building blocks include lasers, optical amplifiers, modulators, detectors and a variety of passive components, including wavelength demultiplexers, filters and couplers. InP-chips with record complexities of more than 1700 components integrated in a single chip have been reported. InP-based foundry processes offer low-cost access to mature integration processes with high performance and wafer-scale integration of InP-based photonic circuits with silicon electronics is emerging. Meint Smit will discuss what’s coming next and why this phase is important. Continue reading “Meint Smit: Next Steps for InP-based Photonic Integration Technology”