Highly accurate flipchip bonding for transceiver applications

bonding

There are highest demands on accuracy of bonding flipchips e.g. on glass substrates to achieve maximum coupling efficiency, which are a challenge likewise for the machine supplier and the process developer. This presentation focuses on machine solutions to provide best possible machine capability but also points towards important aspects to turn this into an appropriate process capability. The FINEPLACER® principle is explained and how this is improved to reach a placement accuracy of 0.3 µm @ 3s.

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The Integrated Photonics Systems Roadmap – International (IPSR-I) 2020 is available now

ipsr-i 2020

The roadmap is a joint initiative of the AIM Academy and PhotonDelta, with the objective to establish and sustain a trust based global network of industrial and R&D partners, who are working together on defining and creating future PIC technology and systems requirements. Continue reading “The Integrated Photonics Systems Roadmap – International (IPSR-I) 2020 is available now”