BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG

Dan Holladay

BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG, at the Photonic Integration Conference 2017, which will take place on September 26, at High Tech Campus Eindhoven, The Netherlands.

BRIDG – Open Innovation Platform to Advance the Commercialization of Revolutionary New Semiconductor-Based Products

  • BRIDG is the first public-private partnership focus on the integration of advanced materials and processes for the manufacturing scale-up of next generation sensors, imagers, and advanced devices / systems. This open innovation platform will provide design, process, packaging, and prototyping solutions for private and collaborative industry based programs – positioned to support a broad base of industry sectors (e.g., Aerospace and Defense, Life Sciences, Food and Agriculture, Robotics and Autonomous Systems, IoT,…)

BRIDG initial Technology Platforms:

  • 3-D and III-V Photonics
  • GaN sensor, imager, and RF devices
  • Heterogenous Integration (2.5 / 3-D) of Si, III-V and Opto-Electronics
  • Private industry programs that leverage BRIDG infrastructure, expertise, and network

The BRIDG Public-Private partnership leverages funding and expertise from governments, universities, and industry – a model that accelerates commercialization and provides cost-effective solutions for SMEs and large companies facing complex product development challenges – “valley-of-death”. Continue reading “BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG”