Huub Claassen, Towa, will talk about “Large scale optical and electrical packaging of photonic devices by using transfer and/or compression molding technology. A possibility to reduce cost”, at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.
The traditional technology for chip encapsulation is Transfer Molding. However, with this technology packaging on Wafer level, very thin BGA and large area size MAP substrates was problematic, Therefore Compression Molding has been developed by the TOWA Corporation of Japan. This method can perform resin flow-free molding by using a granular or liquid type of molding compound.
For both transfer and compression molding processes, fully automatic equipment is available.
In this presentation we would like to explain both molding methods in some detail. The packaging of photonic devices with these methods, to reduce cost, should be possible. Continue reading “Compression molding technology for packaging of photonic devices – Presented by Huub Claassen, Towa”