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Peter Harmsma, program manager at CITC will be the moderator of the 2021 edition of the Photonic Integration Conference. Peter has a background in integrated photonics. He is a senior scientist at TNO with special interest in photonic sensing, and currently acts as program manager photonic packaging at CITC.
Continue reading “Future photonic chip modules will look a lot like todays electronic chip packages”
Advanced packaging of integrated photonic devices based on semiconductor assembly methods. The presentation describes methods for high density flip chip IO, approaches for improved RF performance and assembly packaging in large volumes.
Continue reading “Advanced packaging and assembly of Integrated Photonic devices”
Chip Integration Technology Center (CITC) becomes partner of the Photonic Integration Conference 2021
CITC is a non-proﬁt joint innovation center that specializes in heterogeneous integration and advanced chip packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.
Continue reading “Chip Integration Technology Center Becomes Partner of Photonic Integration Conference”