Future photonic chip modules will look a lot like todays electronic chip packages

moderator

except for a small shiny area on the surface..

Peter Harmsma, program manager at CITC will be the moderator of the 2021 edition of the Photonic Integration Conference. Peter has a background in integrated photonics. He is a senior scientist at TNO with special interest in photonic sensing, and currently acts as program manager photonic packaging at CITC.

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Chip Integration Technology Center Becomes Partner of Photonic Integration Conference

Chip Integration Technology Center

Chip Integration Technology Center (CITC) becomes partner of the Photonic Integration Conference 2021

CITC is a non-profit joint innovation center that specializes in heterogeneous integration and advanced chip packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.

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