Big tech companies would do wise to follow developments in photonics closely – Interview with Dan Holladay, BRIDG

Dan Holladay

Big tech companies would do wise to follow developments in photonics closely – Interview with Dan Holladay, BRIDG

Dan Holladay is executive director of operations and technology programs at BRIDG, an open innovation platform for the semiconductor industry based in the US. Last year he signed a partnership with PhotonDelta in Eindhoven to exchange knowledge, skills and talent in photonics and semiconductor technology.

Holladay has great hope for photonics to bring the world into the ‘terabit era’ when sensors will be infinitely cheaper and higher resolution than they are now. “Think Star Trek or the Jetsons,” he says. “It’s going to be real science fiction.”

On the 26th of September Dan Holladay will speak at the Photonics Integration Conference at High Tech Campus Eindhoven about how innovation platforms can help scale up manufacturing in photonics.

How is photonics going to change technology?
“Photonics will produce new sensor technologies that are needed to enable breakthroughs in fields like robotics, health care, autonomous systems like driverless cars, and food quality. Once photonics devices are integrated and apps are written around them, that’s what’s really going to grow the Internet of Things.” Continue reading “Big tech companies would do wise to follow developments in photonics closely – Interview with Dan Holladay, BRIDG”

BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG

Dan Holladay

BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG, at the Photonic Integration Conference 2017, which will take place on September 26, at High Tech Campus Eindhoven, The Netherlands.

BRIDG – Open Innovation Platform to Advance the Commercialization of Revolutionary New Semiconductor-Based Products

  • BRIDG is the first public-private partnership focus on the integration of advanced materials and processes for the manufacturing scale-up of next generation sensors, imagers, and advanced devices / systems. This open innovation platform will provide design, process, packaging, and prototyping solutions for private and collaborative industry based programs – positioned to support a broad base of industry sectors (e.g., Aerospace and Defense, Life Sciences, Food and Agriculture, Robotics and Autonomous Systems, IoT,…)

BRIDG initial Technology Platforms:

  • 3-D and III-V Photonics
  • GaN sensor, imager, and RF devices
  • Heterogenous Integration (2.5 / 3-D) of Si, III-V and Opto-Electronics
  • Private industry programs that leverage BRIDG infrastructure, expertise, and network

The BRIDG Public-Private partnership leverages funding and expertise from governments, universities, and industry – a model that accelerates commercialization and provides cost-effective solutions for SMEs and large companies facing complex product development challenges – “valley-of-death”. Continue reading “BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG”