Chip Integration Technology Centre (CITC): how Semicon can help Photonics on solving Advanced Packaging challenges – Presented by Barry Peet, BCSEMI NL

Barry Peet program

Chip Integration Technology Centre (CITC): how Semicon can help Photonics on solving Advanced Packaging challenges – Presented by Barry Peet, BCSEMI NL, at the Photonic Integration Conference 2018, which will take place on October 2, at High Tech Campus Eindhoven, The Netherlands.

This presentation will explain the new CITC initiative that is being setup in Nijmegen. Large semicon players (like NXP, Ampleon and Nexperia) combine their knowledge and expertise with Universities like TU Delft and Radboud University to develop new Chip Integration technologies, also in the field of photonics. Continue reading “Chip Integration Technology Centre (CITC): how Semicon can help Photonics on solving Advanced Packaging challenges – Presented by Barry Peet, BCSEMI NL”