Since the first laser diodes and single-mode optical fibers of the early 1990s, the high cost and labor-intensiveness of testing and assembling photonic components have impacted production economics and impeded scaling. With the advent of Silicon Photonics and today’s complex, multi-channel devices, and anticipating adoption of photonics into major new applications fields outside the data center, the newest approaches to improving manufacturing efficiency and yield are seeing high demand.
Continue reading “Addressing the high cost of photonic test and assembly through technology and partnerships”Advanced packaging and assembly of Integrated Photonic devices
Advanced packaging of integrated photonic devices based on semiconductor assembly methods. The presentation describes methods for high density flip chip IO, approaches for improved RF performance and assembly packaging in large volumes.
Continue reading “Advanced packaging and assembly of Integrated Photonic devices”