A use case of open source photonic-design tools on the path to an open photonics innovation hub for optical interconnects – Presented by Tolga Tekin, Fraunhofer IZM

A use case of open source photonic-design tools on the path to an open photonics innovation hub for optical interconnects – Presented by Tolga Tekin, Fraunhofer IZM, at the Photonic Integration Conference 2018, which will take place on October 2, at High Tech Campus Eindhoven, The Netherlands.

We exemplify the impact of open source photonic-design tool in H2020 L3MATRIX project for massive integration. Further, we present the learned lessons from FP7-flagship project on photonic interconnects and the path for the sustainment of the innovation in an photonic innovation hub.

Interview
What drives you?
Innovation

What emerging technologies/trends do you see as having the greatest potential in the short and long run?
Heterogenous integration off core/chip interconnects to enable next generation computing systems

What kind of impact do you expect them to have?
Reduction of CO2 emission

What are the barriers that might stand in the way?
Lack of regional competences in tier-1

What do you hope people to learn from your presentation?
System integration perpectives

About Tolga Tekin
Tolga Tekin has received the Ph.D. degree in electrical engineering and computer science from the Technical University of Berlin, Berlin, Germany, in 2004. He was a Research Scientist with the Optical Signal Processing Department, Fraunhofer HHI, where he was engaged in advanced research on optical signal processing, 3R-regeneration, all-optical switching, clock recovery, and integrated optics.

He was a Postdoctoral Researcher on components for O-CDMA and terabit routers with the University of California. He worked at Teles AG on phased-array antennas and their components for skyDSL. At the Fraunhofer Institute for Reliability and Microintegration (IZM), he then led projects on optical interconnects and silicon photonics packaging.

At the Technical University of Berlin, he then engaged in microsystems, photonic integrated system-in-package,photonic interconnects, and 3-D heterogeneous integration research activities.

He is group manager of ‘Photonics and Plasmonics Systems’ and coordinator of ‘PhoxLab – Independent Platform for Photonics in Data Centers‘ at Fraunhofer IZM and H2020-L3MATRIX.

About Fraunhofer IZM
Founded in 1993, Fraunhofer IZM specializes in applied and industrial contract research on packaging technology and the integration of multifunctional electronics into systems.

Fraunhofer IZM is one of the leading institutes in the field of microelectronics and microsystem packaging worldwide. The institute covers all the competencies needed for advanced packaging such as process development and qualification and reliability and failure analysis with specific links to 3D Wafer level packaging and 3D heterogeneous integration.

The institute has a staff of more than 300 and saw a turnover of 29 million euros in 2016, of which over 85% was earned through contract research.

Fraunhofer IZM operates a state-of-the-art 200/300mm technology line for 3D Wafer level system Integration at its Center „All Silicon System Integration Dresden” (ASSID) and in its labs in Berlin especially focusing on process development, characterization and test as well as qualified manufacturing of 3D systems.

About Photonic Integration Conference 2018
The 4th edition of the Photonic Integration Conference will take place on October 2, 2018, at High Tech Campus Eindhoven, The Netherlands, during Photonics Applications Week.

This edition will focus on business models for applying photonic integration, cases of photonic integration in optical sensing, lighting & energy, IT and telecom – current situation and future prospects.

Photonics is the key enabling technology engine needed to keep the globe communicating and connected in the 21st century. It provides the bandwidth, speed, reach and flexibility needed to run exciting new applications that everyone knows – healthcare & life sciences, internet of things, M2M, social media, big data, datacenters, cloud computing and voice over IP. It’s the most energy efficient technology to scale up all these services.

Join us for a one-day executive conference explaining why integrated photonics is vital to keep our world communicating and connected in the 21st century. We’re bringing the global experts to Eindhoven, the undisputed innovation champion of light technologies.

Programhttps://www.phiconference.com/program/

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