PIC industry overview: design and test trends

by Iñigo Artundo , VLC Photonics

Photonic integration technology is developing fast, quickly moving from an emerging technology status to mass production level. Photonic integrated circuit (PIC) designs are getting more complex, and testing requirements are evolving fast for some application areas like transceivers, quantum, AI or LIDAR. This presentation will provide an overview of current trends from a design house perspective that has been involved in many customer projects and has collaborated with most of the current PIC ecosystem worldwide.

Interview

About Iñigo Artundo

He Obtained the M.Sc. in Telecom Engineering at the Universidad
Publica de Navarra (Pamplona, Spain) in 2005, and received his Ph.D. in
Applied Physics and Photonics at the Vrije Universiteit Brussel
(Brussels, Belgium) in 2009. He has been involved in several national
and European research projects and networks of excellence focused on
reconfigurable optical interconnects, the design, fabrication and
characterization of micro-optic devices, and on flexible access and
in-building fiber network architectures. He has worked as a reviewer for
several scientific journals and national funding agencies. He holds
specializations in Business Financing, Commercial Management and
Research, and Strategic Marketing. He is a member of IEEE, SPIE and
COIT.

What drives you?
VLC Photonics drive is the reliable and expert support to people getting into PICs and companies taking their PICs into production for different markets.

Why should the delegate attend your presentation?
My presentation will give an up-to-date insider view of the PIC industry and its technology and business trends, which will be valuable for anyone developing and planning to commercialize a PIC-based product.

What emerging technologies/trends do you see as having the greatest potential in the short and long run?
This will be exactly the point of my presentation, but as a quick summary: design IP, automated wafer level testing, hybrid and heterogeneous integration, low-cost packaging.

What kind of impact do you expect them to have?
Reduce the cost and development time and increase maturity and volume of PIC products.

What are the barriers that might stand in the way?
Investment in the required technology push to mature manufacturing and packaging, and in market pull to do more outreach and commercial work.

“Special quote”
PIC pioneers VLC Photonics will be discussing their insider view on the technology and market. Don’t miss this unique opportunity!

Photonic Integration Conference 2019 takes place on October 1 in Eindhoven, The Netherlands, during the Photonics Applications Week. For more information about the conference we invite you to visit https://www.phiconference.com/, for more information about the other events during Photonics Applications Week, see https://photonicsapplicationsweek.com/

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