by Aljoscha Schu, ficonTEC
While the photonic industry is obviously growing its capacity for producing photonic monolithic integrated circuits with electro-optical characteristics, the testing of these PIC’s seems to be somewhat behind the industrial expectations.
Fully tested or validated chips are required for many safety-related products, but full wafer-level testing or high-speed single chip testing both need further development in the near term.
Within this presentation, current developments at ficonTEC for PIC testing on single chips at wafer level will be presented. An outlook of possible high-volume and wafer-scale testing concepts will also be outlined.
What drives you?
My Family, success and technology.
Why should the delegate attend your presentation?
To influence actively the next developments or to get an idea about the future challenges in electro-optical probing.
What emerging technologies/trends do you see as having the greatest potential in the short and long run?
Electro-Optical probing and packaging.
What kind of impact do you expect them to have?
The testing capacity might slow down the throughput of chips.
What are the barriers that might stand in the way?
Undeveloped hardware and alignment strategies.
From Lab to Fab
About Aljoscha Schu
Aljoscha Schu has been working for ficonTEC Service GmbH for several years, where he managed international projects from planning to completion, conducting customer negotiations and compiling and completing complex technical processes. Aljoscha successfully completed his training as a microtechnologist at the Institute of Microsensors, Actuators and Systems at the University of Bremen, where he completed his advanced training as a state-certified technician. Afterwards, he gained in-depth knowledge combined with several years of professional experience, which has developed over the years by practical experience as an application engineer and project manager with subsequent change in the technical Sales with specialization on the European market at the company ficonTEC rounded off.
ficonTEC provides automated micro-assembly and testing solutions for the photonics industry. These solutions are realized as cutting-edge, semi- or fully-automated production systems, regardless of the device material and of the specific application the device is targeting. Our modular system architecture is additionally scalable, so that exploratory, proof-of-process assembly as well as high-volume assembly and test requirements are addressable – and anything in between.