Huub Claassen, Towa, will talk about “Large scale optical and electrical packaging of photonic devices by using transfer and/or compression molding technology. A possibility to reduce cost”, at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.
The traditional technology for chip encapsulation is Transfer Molding. However, with this technology packaging on Wafer level, very thin BGA and large area size MAP substrates was problematic, Therefore Compression Molding has been developed by the TOWA Corporation of Japan. This method can perform resin flow-free molding by using a granular or liquid type of molding compound.
For both transfer and compression molding processes, fully automatic equipment is available.
In this presentation we would like to explain both molding methods in some detail. The packaging of photonic devices with these methods, to reduce cost, should be possible.
About Huub Claassen
Graduate engineer of Mechanical Engineering and Electronics.
Since then various positions at NXP Nijmegen and LSI Logic Freemont & Braunschweig.
Founding member of PS Systems, (now owned by Multitest)
Director of Sales for the Besi group.
Since 2005 Managing Director of TOWA Europe B.V.
About TOWA Europe B.V. PDC
The TOWA Corporation of Japan, leading supplier of packaging equipment for Semiconductor, Electronics and LED industries, decided in 2014 to establish an Innovation Center for Package Development: TOWA Europe B.V., where full support in all the phases of package development, can be given.
About Photonic Integration Conference 2017
The 3rd edition of the Photonic Integration Conference will take place on September 26, 2017 at High Tech Campus Eindhoven, The Netherlands.
This edition will focus on business models for applying photonic integration, cases of photonic integration in optical sensing, lighting & energy, IT and telecom – current situation and future prospects.
Speakers from AIM Photonics, PhotonDelta, BRIDG – Bridging the Innovation Development Gap, Tyndall National Institute, University of Glasgow, Fiber To The Home COUNCIL EUROPE, Lightwave Logic, LioniX International and CEA-LETI will be there to talk about the topics of interest.
The conference program also includes a session on “Semicon meets Photonics”, hosted by The Business Cluster Semiconductors Netherlands, where you can catch a glimpse into the important role that photonics is expected to play in the future of the semiconductor industry.