BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG

BRIDG – Open Innovation Platform for New Semiconductor-Based Products – Presented by Dan Holladay, BRIDG, at the Photonic Integration Conference 2017, which will take place on September 26, at High Tech Campus Eindhoven, The Netherlands.

BRIDG – Open Innovation Platform to Advance the Commercialization of Revolutionary New Semiconductor-Based Products

  • BRIDG is the first public-private partnership focus on the integration of advanced materials and processes for the manufacturing scale-up of next generation sensors, imagers, and advanced devices / systems. This open innovation platform will provide design, process, packaging, and prototyping solutions for private and collaborative industry based programs – positioned to support a broad base of industry sectors (e.g., Aerospace and Defense, Life Sciences, Food and Agriculture, Robotics and Autonomous Systems, IoT,…)

BRIDG initial Technology Platforms:

  • 3-D and III-V Photonics
  • GaN sensor, imager, and RF devices
  • Heterogenous Integration (2.5 / 3-D) of Si, III-V and Opto-Electronics
  • Private industry programs that leverage BRIDG infrastructure, expertise, and network

The BRIDG Public-Private partnership leverages funding and expertise from governments, universities, and industry – a model that accelerates commercialization and provides cost-effective solutions for SMEs and large companies facing complex product development challenges – “valley-of-death”.

About Dan Holladay
Dan Holladay has more than 35 years of experience in the semiconductor industry, equally split between manufacturing and R&D. With extensive experience managing research programs, process-engineering and fab operations groups including; analytical labs, equipment engineering, maintenance and facilities departments.

As the Executive Director of Operations and Technology Programs at BRIDG, Holladay is responsible for development of new programs in advanced materials and emerging technology fields. These technology platforms include the development and integration of advanced materials (III-Vs and other novel materials) for universal smart sensors, imagers, photonics, RF, and other advanced devices/systems – both monolithically and through advanced packaging integration (2.5D / 3-D integration).

Before joining BRIDG, Holladay worked at SEMATECH for 20 years in management and director positions for the international consortium’s industry-led technology development programs. Holladay was the Director of Advanced Technologies for SEMATECH’s national and international emerging technology initiatives (including advanced energy), led the formation of the U.S. PV Manufacturing Consortium, and was the executive lead for Department of Energy programs and U.S. federal relationships. In 2012, the concept for BRIDG was formed through these SEMATECH-based emerging technology initiatives. From 2000 to 2008 he served as the Associate Director and Director of Operations for SEMATECH’s advanced R&D lab/fab.

Prior to SEMATECH, Holladay worked 12 years at Honeywell/Atmel in Colorado Springs, Colorado, and five years at Mostek Corp.’s R&D lab in Carrollton, Texas. He also served four years in the Air Force, working in a top secret electronic career field.

About BRIDG – Bridging the Innovation Development Gap
BRIDG is the world’s first industry-led smart sensor consortium.

BRIDG accelerates technology commercialization by providing holistic solutions to bridge technology and capability gaps across multiple fields.

Established in Florida as a not-for-profit, industry-friendly consortium through support of visionary allies
Service areas include research, development, and commercialization
Focused on manufacturing development of advanced technologies in smart sensors, imagers, advanced devices, and 2.5D/3D chip integration

By leveraging technology capabilities, processes, and background intellectual property, BRIDG develops advanced lab/fab and universal technology platforms to provide unrivaled economies of scale needed for cost-effective manufacturing.

Photonic Integration Conference 2017About Photonic Integration Conference 2017
The 3rd edition of the Photonic Integration Conference will take place on September 26, 2017 at High Tech Campus Eindhoven, The Netherlands.

This edition will focus on business models for applying photonic integration, cases of photonic integration in optical sensing, lighting & energy, IT and telecom – current situation and future prospects.

Speakers from AIM Photonics, PhotonDelta, BRIDG – Bridging the Innovation Development Gap, Tyndall National Institute, University of Glasgow, Fiber To The Home COUNCIL EUROPE, Lightwave Logic, LioniX International and CEA-LETI will be there to talk about the topics of interest.

The conference program also includes a session on “Semicon meets Photonics”, hosted by The Business Cluster Semiconductors Netherlands, where you can catch a glimpse into the important role that photonics is expected to play in the future of the semiconductor industry.

Program: https://www.phiconference.com/program/

Registration: https://www.phiconference.com/register/

 

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