Advanced packaging and assembly of Integrated Photonic devices

Advanced packaging of integrated photonic devices based on semiconductor assembly methods. The presentation describes methods for high density flip chip IO, approaches for improved RF performance and assembly packaging in large volumes.

A presentation by Sander Dorrestein, Senior electronic and optical packaging engineer, TNO / CITC.

Interview

Question 1: What drives you?
Develop new advanced technologies, bring the best of semiconductor packaging technologies to assembly of integrated photonic devices.

Question 2: Why should the delegate attend your presentation?
Fresh look into assembly methods for integrated photonic devices from a semiconductor assembly approaches.

Question 3: What emerging technologies/trends do you see as having the greatest potential in the short and long run?
More function per mm2 requires high density electrical IO, Hunger for data require advanced RF design, simplified assembly to reduce cost for assembly.

Question 4: What kind of impact do you expect them to have?
More adaptation of integrated photonics.

Question 5: What are the barriers that might stand in the way?
Cost, complicated assembly methods, lack of standardization.

About Sander Dorrestein
Sander is Micro-electronic Packaging Process Engineer at TNO and started working for CITC per May 1, 2020. Sander is a mechanical engineer with special interest in micro-assembly processes and technologies. He has a broad experience in the field of bonding and joining applications for both micro-electrical and micro-optical packaging. He has a proven track record of developing bonding and joining processes which are currently used in production for consumer, medical, industrial and automotive applications.

About CITC
CITC is a non-profit joint innovation center that specializes in heterogeneous integration and advanced chip packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.

Sander Dorrestein is speaker at the 2021 edition of the Photonic Integration Conference.

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