Below you can find the speaker partners of the Photonic Integration Conference 2017
 Lightwave Logic is dedicated to developing and commercializing next generation technology to replace existing data communications and telecommunications interconnect infrastructure with advanced optical devices that are part of a Polymer Photonic Integrated Circuit (Polymer PIC) platform.
Our goal is to meet today’s demands and the future needs for the movement of ever increasing data at decreased costs. |
 The University of Glasgow, founded in 1451, is the fourth oldest university in the English-speaking world, ranking in the top 1% of universities worldwide.
Its School of Engineering hosts the James Watt Nanofabrication Centre, one of Europe’s leading fabrication facilities, and has pioneered research in integrated optics since the 1970s. |
 BRIDG is the world’s first industry-led smart sensor consortium. BRIDG accelerates technology commercialization by providing holistic solutions to bridge technology and capability gaps across multiple fields.
Established in Florida as a not-for-profit, industry-friendly consortium through support of visionary allies. Service areas include research, development, and commercialization |
 LioniX International focuses on Photonic Integrated Circuits (PIC) enabled modules based on its proprietary waveguide technology (TriPleX™), in addition to its other core competences micro-fluidics, opto-fluidics and MEMS.
As a vertical integrated company it delivers a complete solution to OEM customers: from initial design through volume manufacturing of products. |
 Our mission is to create a national institute supporting the end-to-end integrated photonics manufacturing ecosystem in the U.S. by expanding upon a highly successful public-private partnership model with open-access to world-class shared-use resources and capabilities. |
 CEA-LETI is one of the major European research centres for Microelectronics Micro- and Nano-technology and Integrated Photonics. Nearly 2000 persons are serving innovation and the transfer of technology in key domains. As the preferred contact of the industrial world, CEA-LETI has sparked the creation of nearly thirty high-technology startups. CEA-Leti is located in Grenoble where it benefits from state-of-the-art clean rooms including 200 mm & 300 mm IC and 200 mm MEMS prototyping pilot lines. |
 PIXAPP is an EU funded Pilot Line established in early 2017 to address the need for scale-up of photonic packaging to low and medium volumes, and ultimately support high volume photonic manufacturing in Europe.
PIXAPP provides a wide range of packaging technologies, as well as advanced training programmes and support in the development of technology roadmaps. |
 The TOWA Corporation of Japan, leading supplier of packaging equipment for Semiconductor, Electronics and LED industries, decided in 2014 to establish an Innovation Center for Package Development: TOWA Europe B.V., where full support in all the phases of package development, can be given. |
 Salland Engineering is an international leading Test Technology & Engineering company in business since 1992, specialized in solutions & services that enable semiconductor manufacturers to improve the efficiency and quality of their testing.
Our core expertise is to deliver Solutions via a unique combination of innovative Test Technology and Turn-Key Solutions, including Instruments, Applications expertise and supply chain & test services. |
 The FTTH Council Europe is a non-profit organisation with a mission to accelerate ubiquitous, fibre-based connectivity empowering a leading Digital Society throughout Europe.
Created in 2004 by Alcatel-Lucent, Cisco, Corning, Emtelle and OFS, the FTTH Council has now more than 150 members. |
 Shared EDA is a non-profit organization dedicated to strengthen the Electronic Design Automation (EDA) ecosystem.
The organization licenses EDA tools and coordinates relevant trainings, workshops, transfer of knowledge and sharing of semiconductor IP. |
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