The conference program hours are 13:30 – 17:00 CET.

stefan mohrdiekStefan Mohrdiek, Head Functional Packaging, CSEM
Peter O'BrienPeter O'Brien, Head of Research Group, Tyndall National Institute / Director, Photonics Packaging Pilot Line
scott jordanScott Jordan, Head of Photonics / Sr. Director, NanoAutomation
Session: Equipment for Photonics Assembly: challenges & solutions
Ralph SchachlerRalph Schachler, Sales Manager Germany & Benelux, Finetech GmbH
arno thoerArno Thoer, Director Technology & Engineering, TEGEMA
Session: Materials & processes for Photonics Assembly: challenges & solutions
sander dorresteinSander Dorrestein, Senior researcher micro electronic and micro-optical packaging, CITC - Chip Integration Technology Center
nikolaus flöryNikolaus Flöry, Business Development Manager, vario-optics AG, on "Electro-Optic Circuit Boards - an advanced photonic chip packaging platform", Read more

After the conference there will be a guided Chip Integration Technology Center (CITC) labtour for the participants of the live conference. It is free to attend, but the number of places is limited, so make sure you select the option when you register for the conference. Access to Infrastructure – CITC – Access to infrastructure with lab facilities.

Want to know who spoke at earlier editions, click here to find out.

The conference program is part of the Photonics Applications Week. It is possible to attend several events / conferences / workshops during this week.

Photonics is the key enabling technology engine needed to keep the globe communicating and connected in the 21st century. The integration of optical components and functions into large-scale photonic integrated circuits (PIC) will result in miniaturisation and decrease of costprice, which will lead to more applications. It’s the most energy efficient technology to scale up all these services.

Packaging and assembly technologies though are crucial to make devices available for high-volume and low-cost applications. This includes heterogeneous integration: the dense integration of compound semiconductor photonics and silicon microelectronics. It allows for significant reductions in system size, weight and power, while simultaneously yielding performance improvements and new functionality.

This edition of the conference has its focus on packaging and assembly with the following topics:

  • Materials & processes for Photonics Assembly: challenges & solutions
  • Equipment for Photonics Assembly: challenges & solutions