If you want to know who spoke at earlier editions, click here to find out.

The conference program is part of the Photonics Applications Week. It is possible to attend several events / conferences / workshops during this week.

Photonics is the key enabling technology engine needed to keep the globe communicating and connected in the 21st century. The integration of optical components and functions into large-scale photonic integrated circuits (PIC) will result in miniaturisation and decrease of costprice, which will lead to more applications. It’s the most energy efficient technology to scale up all these services.

Packaging and assembly technologies though are crucial to make devices available for high-volume and low-cost applications. This includes heterogeneous integration: the dense integration of compound semiconductor photonics and silicon microelectronics. It allows for significant reductions in system size, weight and power, while simultaneously yielding performance improvements and new functionality.

This edition of the conference has its focus on packaging and assembly with the following topics:

  • Materials & processes for Photonics Assembly: challenges & solutions
  • Equipment for Photonics Assembly: challenges & solutions