“PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap

“PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap, at Photonic Integration Conference, Sep 27, 2016, High Tech Campus Eindhoven, The Netherlands.

A review of the possibilities for PIC packaging & what to consider for when assessing the needs of your PIC prototype package platform.

Advice on how to navigate the package development stepping stones to get your product into production.

About Andrew Thompson
Former roles include Senior R&D Engineer at Agilent Technologies working 10Gb optical Transceivers. Developed world first non-hermetic, Telecordia compliant network transceiver using MT-RJ connector & Silicon V-groove technology.

Joined Optocap as a project manager after working at e2v Technologies. Current role at Optocap covers applications support for Optoelectronic & Microelectronic projects.

About Optocap
Optocap is an Optoelectronic and Microelectronic, component package design, assembly & test service provider. All our Design & Assembly operations are within the UK and our Test services are located in France & Spain.

We support start ups, Universities, SME & Multinationals, H2020 Consortiums with a flexible packaging services.

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