“Photonic Integrated Circuit platforms for Multi Project Wafer access” – Presented by Arne Leinse, LioniX International

“Photonic Integrated Circuit platforms for Multi Project Wafer access” – Presented by Arne Leinse, LioniX International at Photonic Integration Conference, Sep 27, 2016, High Tech Campus Eindhoven, The Netherlands.

In the presentation an overview of the currently available PIC platforms, with easy Multi Project Wafer access, will be given. The state of the art and the Unique Selling Point of each platform will be presented  in order to facilitate an easy choice and access for users to the varies platforms.

About Arne Leinse
Arne Leinse Ph.D (Chief Commercial Officer) is active in integrated optics for more than 15 years. He received a PhD degree from the University of Twente in the integrated Optical Microsystems group in 2005. Hereafter he joined LioniX BV where he was involved in the invention and development of the TriPleX™ platform from the beginning. He has been involved from the original concept until the exploitation and (co)authored over 100 articles in the last years. He has been active as Vice-President of LioniX BV in the last years and since the establishment of LioniX-international in 2016 active in the role of Chief Commercial Officer.

About LioniX International
LioniX International focuses on Photonic Integrated Circuits (PIC) enabled modules based on its proprietary waveguide technology (TriPleX™), in addition to its other core competences micro-fluidics, opto-fluidics and MEMS. With a vertical integration it delivers a complete solution to its OEM customers: from initial design through volume manufacturing of products.

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