Photonic Integration Conference 2017 welcomes PIC International magazine as Media Partner

Photonic Integration Conference 2017 welcomes PIC Magazine as Media Partner

About PIC International magazine

, simulation, fabrication, testing, packaging and measurement of photonic integrated circuits, including a ‘deep dive’ into the various materials platforms from today’s InP technology through to challenges from silicon photonics and polymer systems. Beyond that, the title will highlight research breakthroughs with commercial potential and examine customer requirements.
The publication brings together suppliers, designers and manufacturers across the PIC ecosystem from development through to application, providing a forum for the community to share opinions on the challenges ahead, roadmap progress and open up new markets.

About Photonic Integration Conference 2017

On September 26, 2017, the 3rd edition of the Photonic Integration Conference will take place at High Tech Campus Eindhoven, The Netherlands.

The following topics will be approached during the conference:

  • Business models for applying Photonic Integration
  • Cases of Photonic Integration in optical sensing, lighting & energy, displays, information technology, telecom, healthcare & life science, security & defence, robotic manufacturing processes
  • Integration of photonics with microelectronics at the chip, board and system levels
  • Tools for developing and packaging

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