The cost of photonic components is dominated by assembly and packaging processes. This is a drag on adoption at a time when rapid global scaling of connectivity is required. To break this chicken and the egg problem, a fast, flexible, accurate and cost-effective solution for automated photonic-component assembly has been needed.
Continue reading “Photonic component assembly systems suitable for every business case”
There are highest demands on accuracy of bonding flipchips e.g. on glass substrates to achieve maximum coupling efficiency, which are a challenge likewise for the machine supplier and the process developer. This presentation focuses on machine solutions to provide best possible machine capability but also points towards important aspects to turn this into an appropriate process capability. The FINEPLACER® principle is explained and how this is improved to reach a placement accuracy of 0.3 µm @ 3s.
Continue reading “Highly accurate flipchip bonding for transceiver applications”
Since the first laser diodes and single-mode optical fibers of the early 1990s, the high cost and labor-intensiveness of testing and assembling photonic components have impacted production economics and impeded scaling. With the advent of Silicon Photonics and today’s complex, multi-channel devices, and anticipating adoption of photonics into major new applications fields outside the data center, the newest approaches to improving manufacturing efficiency and yield are seeing high demand.
Continue reading “Addressing the high cost of photonic test and assembly through technology and partnerships”
Unlike mainly silicon-based electronics, photonic integration is characterized on one hand by a large diversity of material platforms used (Si, SiN, InP, GaAs, polymers) and on the other hand by wavelengths ranging from UV to the far infrared. In view of the difficulties to establish common, standardized platforms, heterogeneous integration continues to be a key element to drive new technologies and scientific advances for the next decade. The combination of heterogeneous functionalities with optical, thermal, electrical, fluidic, mechanical, and high frequency characteristics requires specialized materials and system integration (packaging and assembly) processes and equipment.
Continue reading “Photonic multi-domain integration trends”
Advanced packaging of integrated photonic devices based on semiconductor assembly methods. The presentation describes methods for high density flip chip IO, approaches for improved RF performance and assembly packaging in large volumes.
Continue reading “Advanced packaging and assembly of Integrated Photonic devices”
Photonic integrated circuits are playing a key role in various next generation sensing and telecommunication applications. Packaging of such chips has become the bottleneck of their integration and deployment. A novel platform based on poylmer waveguides integrated with electrical PCBs is presented, which allows to simultaneously interface photonic chips electrically and optically at high port-densities. Design rules and examples of this novel chip-packaging platform are discussed and showcased.
Continue reading “Electro-Optic Circuit Boards – an advanced photonic chip packaging platform”
Presentation by Maarten Buijs, Roadmap and Program Consultant at PhotonDelta.
Rapid and cost-effective diagnostics at the point of care has been pursued for decades, but so far only little progress has been achieved. This became painfully apparent with the outbreak of the Covid-19 pandemic.
Continue reading “Integrated photonic biosensors: leading the path to point-of-care diagnostics”
Presentation by Carol de Vries, Technology and System consultant at PhotonDelta
The automotive industry is going through unprecedented changes, driven by 3 mega trends that are happening in the same timeframe. These are electrification, the drive towards autonomous vehicles & driver support systems, and the change in mobility patterns and city infrastructure.
Continue reading “Megatrends in the automotive & mobility sector and the role of integrated photonics”
A JakajimaTV interview with Gerrit Muller. This interview gives a glimpse of his vision on System Architecture / System Engineering.
Photonics is a specific set of technologies with many real world applications. Users operate these applications using various systems that in turn deploy a wide variety of technologies.
Continue reading “System Architecture and Photonics!”
A JakajimaTV talk hosted by Pieter Hermans with Ivana Sersic Vollenbroek, Project Manager at Demcon Advanced Mechatronics.
Continue reading “How to develop products with PICs”