Photonic component assembly systems suitable for every business case

arno thoer

The cost of photonic components is dominated by assembly and packaging processes. This is a drag on adoption at a time when rapid global scaling of connectivity is required. To break this chicken and the egg problem, a fast, flexible, accurate and cost-effective solution for automated photonic-component assembly has been needed.

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Highly accurate flipchip bonding for transceiver applications

bonding

There are highest demands on accuracy of bonding flipchips e.g. on glass substrates to achieve maximum coupling efficiency, which are a challenge likewise for the machine supplier and the process developer. This presentation focuses on machine solutions to provide best possible machine capability but also points towards important aspects to turn this into an appropriate process capability. The FINEPLACER® principle is explained and how this is improved to reach a placement accuracy of 0.3 µm @ 3s.

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Addressing the high cost of photonic test and assembly through technology and partnerships

cost

Since the first laser diodes and single-mode optical fibers of the early 1990s, the high cost and labor-intensiveness of testing and assembling photonic components have impacted production economics and impeded scaling. With the advent of Silicon Photonics and today’s complex, multi-channel devices, and anticipating adoption of photonics into major new applications fields outside the data center, the newest approaches to improving manufacturing efficiency and yield are seeing high demand.

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Photonic multi-domain integration trends

stefan mohrdiek

Unlike mainly silicon-based electronics, photonic integration is characterized on one hand by a large diversity of material platforms used (Si, SiN, InP, GaAs, polymers) and on the other hand by wavelengths ranging from UV to the far infrared. In view of the difficulties to establish common, standardized platforms, heterogeneous integration continues to be a key element to drive new technologies and scientific advances for the next decade. The combination of heterogeneous functionalities with optical, thermal, electrical, fluidic, mechanical, and high frequency characteristics requires specialized materials and system integration (packaging and assembly) processes and equipment.

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Electro-Optic Circuit Boards – an advanced photonic chip packaging platform

nikolaus flöry

Photonic integrated circuits are playing a key role in various next generation sensing and telecommunication applications. Packaging of such chips has become the bottleneck of their integration and deployment. A novel platform based on poylmer waveguides integrated with electrical PCBs is presented, which allows to simultaneously interface photonic chips electrically and optically at high port-densities. Design rules and examples of this novel chip-packaging platform are discussed and showcased.

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Integrated photonic biosensors: leading the path to point-of-care diagnostics

biosensors

Presentation by Maarten Buijs, Roadmap and Program Consultant at PhotonDelta.

Rapid and cost-effective diagnostics at the point of care has been pursued for decades, but so far only little progress has been achieved. This became painfully apparent with the outbreak of the Covid-19 pandemic.

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Megatrends in the automotive & mobility sector and the role of integrated photonics

automotive

Presentation by Carol de Vries, Technology and System consultant at PhotonDelta

The automotive industry is going through unprecedented changes, driven by 3 mega trends that are happening in the same timeframe. These are electrification, the drive towards autonomous vehicles & driver support systems, and the change in mobility patterns and city infrastructure.

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