New generic platform for the prototyping & production of photonic integrated circuits

generic platform

New generic platform for the prototyping & production of photonic integrated circuits

LIGENTEC, a leading provider of manufacturing foundry services in silicon nitride, and VLCPhotonics, a pioneer design house offering services for photonic circuit development, have collaborated to offer a generic platform for the prototyping and production of photonic integrated circuits.

LIGENTEC has matured a proprietary silicon nitride process that is able to achieve ultra-low propagation losses, with several world record devices being published in the last years. As Michael Zervas, CEO of LIGENTEC, explains: “Our process is able to deposit thick film silicon nitride, from 100 nm to 2500 nm, overcoming the challenge of crack formation due to stress in the material”. The process can also scale up to production volumes using 8” wafers and stepper lithography. Continue reading “New generic platform for the prototyping & production of photonic integrated circuits”

“Photonics, PICs and the Digitization of European Industry” – Presented by Ronan Burgess, European Commission

Ronan Burgess

“Photonics, PICs and the Digitization of European Industry” – Presented by Ronan Burgess, European Commission, at the Photonic Integration Conference, September 27, 2016, at High Tech Campus Eindhoven, The Netherlands.

This presentation will give an overview of Photonics in Horizon 2020, the EU Framework Programme for Research and Innovation. The core of Horizon 2020 support for Photonics is to be found in the Photonics PPP, which will provide up to 700 million euro funding for research and innovation activities in photonics over the 7 years of Horizon 2020. The speaker will give an overview of what has been achieved in the first years of Horizon 2020 and in particular the activities related to integrated photonics. Finally the potential of photonics in boosting the competitiveness of European industry will be addressed and how the EU’s policy on the “Digitization of European Industry” will provide an opportunity for the entire photonics sector. Continue reading ““Photonics, PICs and the Digitization of European Industry” – Presented by Ronan Burgess, European Commission”

“JePPIX: Generic Foundry for InP and SiN Photonic Integrated Circuits” – Presented by Valentina Moskalenko, JePPIX

“JePPIX: Generic Foundry for InP and SiN Photonic Integrated Circuits” – Presented by Valentina Moskalenko, JePPIX, at Photonic Integration Conference, Sep 27, 2016, at High Tech Campus Eindhoven, The Netherlands.

The presentation will introduce generic integration platform offered by JePPIX. We will present fabless model which allows to reduce the entry costs of a PIC prototype via participation in multiproject wafer runs down to a level that is affordable for many SMEs and universities. The talk will be focused on design process cycle and possibilities provided by InP and SiN generic platforms. Continue reading ““JePPIX: Generic Foundry for InP and SiN Photonic Integrated Circuits” – Presented by Valentina Moskalenko, JePPIX”

“PhotonDelta 2017 – The next phase begins!” – Ewit Roos, PhotonDelta

ewit roos speaker photonic integration conference

“PhotonDelta 2017 – The next phase begins!” – presented by Ewit Roos, PhotonDelta, at Photonic Integration Conference, Sep 27, 2016, High Tech Campus Eindhoven, The Netherlands.

The European Photonics market is now worth around €70 billion. Grant funding to support research and innovation in SME’s has grown to reach €100M a year. But PhotonDelta argues that a more collaborative approach is the way to ensure European photonics gets 10-20 times the funding we see today. In his talk, Ewit Roos will outline extensive plans to assist photonics companies and related supply chains accelerate their time to market. He will explain why the new PhotonDelta cooperative is offering early access to IP as well as organising deep-dive strategy workshops to construct long-term technology roadmaps. Continue reading ““PhotonDelta 2017 – The next phase begins!” – Ewit Roos, PhotonDelta”

“Photonic Integrated Circuit platforms for Multi Project Wafer access” – Presented by Arne Leinse, LioniX International

“Photonic Integrated Circuit platforms for Multi Project Wafer access” – Presented by Arne Leinse, LioniX International at Photonic Integration Conference, Sep 27, 2016, High Tech Campus Eindhoven, The Netherlands.

In the presentation an overview of the currently available PIC platforms, with easy Multi Project Wafer access, will be given. The state of the art and the Unique Selling Point of each platform will be presented  in order to facilitate an easy choice and access for users to the varies platforms. Continue reading ““Photonic Integrated Circuit platforms for Multi Project Wafer access” – Presented by Arne Leinse, LioniX International”

“PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap

“PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap, at Photonic Integration Conference, Sep 27, 2016, High Tech Campus Eindhoven, The Netherlands.

A review of the possibilities for PIC packaging & what to consider for when assessing the needs of your PIC prototype package platform.

Advice on how to navigate the package development stepping stones to get your product into production. Continue reading ““PIC Package Assembly Building Blocks” – Presented by Andrew Thompson, Optocap”

There’s a ‘light on a chip’ revolution coming and Europe is in the lead

Demand for bandwidth is exploding

It’s tough being a data center these days. Demand for bandwidth is exploding. Every second, two households are connected to the Internet, and the amount of data doubles for each connection every 18 months. In 2016, over a billion smartphones will be sold worldwide, and each device needs access to a data center.

Silicon Valley, we have a problem. Continue reading “There’s a ‘light on a chip’ revolution coming and Europe is in the lead”