New pilot line to be incubator of photonics multinationals in Eindhoven
Photonics is an emerging technology with a potential multitrillion market. Innovative small and medium sized enterprises (SMEs) are at the forefront of this development, but the R&D costs are prohibitive for them. That’s why 12 partners from northwestern Europe are creating an open access pilot line that will drastically reduce costs and time for the pilot production of new products. This new facility is projected to be the incubator of a thousand new companies and thousands of jobs. The 14 million euro project (OIP4NWE) is supported by the European Regional Development Fund and kicked off this week in Eindhoven. Continue reading “New pilot line to be incubator of photonics multinationals in Eindhoven”
“Si photonics growth is now confirmed”, announces Dr. Eric Mounier from Yole Développement (Yole). “Therefore, the development of Si photonics technologies is especially driven by the intra & inter data center applications. Silicon photonics is today one of the most valuable answers to high data rate/low cost for distances beyond VCSEL’s reach.”
The market research and strategy consulting company, Yole investigates the Si photonics sector for years now and was already announcing its take-off in 2017. This year, the trend is confirmed, strongly supported by the needs of data management and performances. Continue reading “Silicon photonics market to boom for 100G then 400G, research shows”
One of the biggest challenges in developing integrated photonic circuits — which use light rather than electrons to transport information — is to control the momentum of light. Colors of light travel at different speeds through a material but in order for light to be converted between colors, it needs to have the same momentum or phase.
Many devices have been designed to momentum-match or phase-match light at various points throughout an integrated circuit but what if the phase-matching process could be circumvented all together in certain cases?
Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences, together with collaborators from the Fu Foundation School of Engineering and Applied Science at Columbia University, have developed a system to convert one wavelength of light into another without the need to phase match.
“For any wavelength conversion process to be efficient, it has to be carefully designed to phase match, and it only works at a single wavelength,” said Marko Loncar, the Tiantsai Lin Professor of Electrical Engineering at SEAS and senior author of the paper. “The devices shown in this work, in contrast, do not need to satisfy the phase-matching requirement, and can convert light in a broad color range.” Continue reading “Researchers develop system to convert one wavelength of light into another without need to phase match”
Instant diagnosis of major diseases, eradication of all road accidents, some of the benefits to be generated by European Photonics, study shows
Instant diagnosis of major diseases, the eradication of all road accidents, and the creation of 1 million new jobs are some of the benefits that will be generated by the Photonics sector by 2030 according to a new vision paper published by Photonics21.
The vision paper ‘Europe’s Age of Light’ sets out a new strategy for the future of European photonics highlighting what could be achieved if this technology is maintained by the EU as a key funding priority in FP9. The paper was created through consultation with the photonics community, including more than 1,700 companies and research organizations.
Continue reading “Instant diagnosis of major diseases, eradication of all road accidents, some of the benefits to be generated by European Photonics, study shows”
New generic platform for the prototyping & production of photonic integrated circuits
LIGENTEC, a leading provider of manufacturing foundry services in silicon nitride, and VLCPhotonics, a pioneer design house offering services for photonic circuit development, have collaborated to offer a generic platform for the prototyping and production of photonic integrated circuits.
LIGENTEC has matured a proprietary silicon nitride process that is able to achieve ultra-low propagation losses, with several world record devices being published in the last years. As Michael Zervas, CEO of LIGENTEC, explains: “Our process is able to deposit thick film silicon nitride, from 100 nm to 2500 nm, overcoming the challenge of crack formation due to stress in the material”. The process can also scale up to production volumes using 8” wafers and stepper lithography. Continue reading “New generic platform for the prototyping & production of photonic integrated circuits”
Shared EDA: EDA Tools, Knowledge and IP Made Available for Start-Ups and SMEs – Presented by Christiaan van der Sluijs, Shared EDA, at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.
The needs of today’s electronic design companies are demanding. EDA tools and Intellectual Property (IP) libraries are critical enablers for developing and maintaining successful products and services.
Shared EDA is an organization dedicated to strengthen the Electronic Design Automation (EDA) ecosystem. The organization licenses EDA tools and coordinates relevant trainings, workshops, transfer of knowledge and sharing of semiconductor IP. By sharing Licenses and IP, the electronic design companies are enabled to use EDA tools and IP as if they were a large enterprise, including the benefits (e.g. re-mix, price).
Shared EDA offers EDA tools vendors a converging business model that caters to the demanding needs of today’s electronic design companies. Over the past 5 years, Shared EDA changed the game of licensing EDA tools. Continue reading “Shared EDA: EDA Tools, Knowledge and IP Made Available for Start-Ups and SMEs – Presented by Christiaan van der Sluijs, SharedEDA”
Photonic Integrated Circuits are Enabling Innovative Products
People from all over the world will be present at the 3rd Annual Photonic Integration Conference which will take place at the High Tech Campus in Eindhoven. One of the keynotes will be by Lightwave Logic CEO Dr. Michael Lebby. His main message: “Photonic Integrated Circuits are Enabling Innovative Products.”
Dr. Lebby will provide an overview of the data communications environment and the latest results of polymer PICs that can scale using 50Gbps modulators for 400Gbps applications. His company, Lightwave Logic, is a technology company focused on the development of Next Generation Photonic Devices and Non-Linear Optical Polymer Materials Systems for applications in high-speed fiber-optic data communications and telecommunications.
The 3rd Annual Photonic Integration Conference is a technical conference that focuses only on PIC based technologies and attracts speakers and companies from all over the world and is attended by senior stakeholders in the integrated photonics value-chain. Continue reading “Photonic Integrated Circuits are Enabling Innovative Products”
Huub Claassen, Towa, will talk about “Large scale optical and electrical packaging of photonic devices by using transfer and/or compression molding technology. A possibility to reduce cost”, at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.
The traditional technology for chip encapsulation is Transfer Molding. However, with this technology packaging on Wafer level, very thin BGA and large area size MAP substrates was problematic, Therefore Compression Molding has been developed by the TOWA Corporation of Japan. This method can perform resin flow-free molding by using a granular or liquid type of molding compound.
For both transfer and compression molding processes, fully automatic equipment is available.
In this presentation we would like to explain both molding methods in some detail. The packaging of photonic devices with these methods, to reduce cost, should be possible. Continue reading “Compression molding technology for packaging of photonic devices – Presented by Huub Claassen, Towa”
Multiphoton Optics introduces new 3D Printing Platform
- LithoProf3D operates with high precision for industrial applications
- Up-to-date laser technology for diverse substrates and formats
- Heidelberger Druckmaschinen as global production partner
Multiphoton Optics GmbH, Würzburg, offers with its LithoProf3D a 3D Printing Platform to scale the high-precision 3D printing for a large variety of products in many different markets. Arbitrarily shaped 3D structures can be fast and reliably fabricated via maskless laser direct writing on surfaces of a volume of a material. Structures can be additively or subtractively created, using different exposure strategies. Structure fabrication can be carried out on large areas with tunable precision on demand.
Continue reading “Multiphoton Optics introduces new 3D Printing Platform”
Researchers at Chalmers University of Technology have developed a method that enables them to manipulate light to follow any predetermined path along a surface. Continue reading “Researchers develop method that enables them to manipulate light to follow any predetermined path along a surface”