Silicon photonics in 3 µm SOI – Presented by Timo Aalto, VTT

Timo Aalto

Silicon photonics in 3 µm SOI – Presented by Timo Aalto, VTT, at the Photonic Integration Conference 2018, which will take place on October 2, at High Tech Campus Eindhoven, The Netherlands.

Latest progress in the development of silicon photonics on VTT’s 3 µm SOI platform is presented. This includes active and passive components, as well as broadband I/O coupling solutions. Also some hybrid integration of III-V optoelectronics on SOI is presented. Continue reading “Silicon photonics in 3 µm SOI – Presented by Timo Aalto, VTT”

Resonators and Waveguides for Fiber Optics and Integrated Photonics – Presented by Ali Serpenguzel, Koç University

Ali Serpenguzel

Resonators and Waveguides for Fiber Optics and Integrated Photonics – Presented by Ali Serpenguzel, Koç University, at the Photonic Integration Conference 2018, which will take place on October 2, at High Tech Campus Eindhoven, The Netherlands.

Spherical optical microcavities are the building blocks of three dimensional photonics, as linear optical microcavities are the building blocks of one dimensional photonics. Dielectric and semiconductor based lightwave circuit elements are being integrated into fiber optics and integrated photonics. Silicon microspheres lead themselves to various lightwave circuit element applications such as channel dropping filters, tunable filters, and optical modulators using optical fiber half couplers manufactured from single mode optical fibers. Continue reading “Resonators and Waveguides for Fiber Optics and Integrated Photonics – Presented by Ali Serpenguzel, Koç University”

Silicon photonics market to boom for 100G then 400G, research shows

Silicon photonics market

“Si photonics growth is now confirmed”, announces Dr. Eric Mounier from Yole Développement (Yole). “Therefore, the development of Si photonics technologies is especially driven by the intra & inter data center applications. Silicon photonics is today one of the most valuable answers to high data rate/low cost for distances beyond VCSEL’s reach.”
The market research and strategy consulting company, Yole investigates the Si photonics sector for years now and was already announcing its take-off in 2017. This year, the trend is confirmed, strongly supported by the needs of data management and performances. Continue reading “Silicon photonics market to boom for 100G then 400G, research shows”

Researchers develop system to convert one wavelength of light into another without need to phase match

wavelength of light

One of the biggest challenges in developing integrated photonic circuits — which use light rather than electrons to transport information — is to control the momentum of light.  Colors of light travel at different speeds through a material but in order for light to be converted between colors, it needs to have the same momentum or phase.

Many devices have been designed to momentum-match or phase-match light at various points throughout an integrated circuit but what if the phase-matching process could be circumvented all together in certain cases?

Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences, together with collaborators from the Fu Foundation School of Engineering and Applied Science at Columbia University, have developed a system to convert one wavelength of light into another without the need to phase match.

“For any wavelength conversion process to be efficient, it has to be carefully designed to phase match, and it only works at a single wavelength,” said Marko Loncar, the Tiantsai Lin Professor of Electrical Engineering at SEAS and senior author of the paper. “The devices shown in this work, in contrast, do not need to satisfy the phase-matching requirement, and can convert light in a broad color range.” Continue reading “Researchers develop system to convert one wavelength of light into another without need to phase match”

Instant diagnosis of major diseases, eradication of all road accidents, some of the benefits to be generated by European Photonics, study shows

Instant diagnosis

Instant diagnosis of major diseases, eradication of all road accidents, some of the benefits to be generated by European Photonics, study shows

Instant diagnosis of major diseases, the eradication of all road accidents, and the creation of 1 million new jobs are some of the benefits that will be generated by the Photonics sector by 2030 according to a new vision paper published by Photonics21.

The vision paper ‘Europe’s Age of Light’ sets out a new strategy for the future of European photonics highlighting what could be achieved if this technology is maintained by the EU as a key funding priority in FP9. The paper was created through consultation with the photonics community, including more than 1,700 companies and research organizations.

Continue reading “Instant diagnosis of major diseases, eradication of all road accidents, some of the benefits to be generated by European Photonics, study shows”

New generic platform for the prototyping & production of photonic integrated circuits

generic platform

New generic platform for the prototyping & production of photonic integrated circuits

LIGENTEC, a leading provider of manufacturing foundry services in silicon nitride, and VLCPhotonics, a pioneer design house offering services for photonic circuit development, have collaborated to offer a generic platform for the prototyping and production of photonic integrated circuits.

LIGENTEC has matured a proprietary silicon nitride process that is able to achieve ultra-low propagation losses, with several world record devices being published in the last years. As Michael Zervas, CEO of LIGENTEC, explains: “Our process is able to deposit thick film silicon nitride, from 100 nm to 2500 nm, overcoming the challenge of crack formation due to stress in the material”. The process can also scale up to production volumes using 8” wafers and stepper lithography. Continue reading “New generic platform for the prototyping & production of photonic integrated circuits”

Towards an end-to-end photonics ecosystem – Interview with Michael Liehr, AIM Photonics

Michael Liehr

Towards an end-to-end photonics ecosystem – Interview with Michael Liehr, AIM Photonics

Michael Liehr is the Chief Executive Officer of the American Institute for Manufacturing (AIM) of Integrated Photonics and the SUNY Poly Executive Vice President for Technology and Innovation

The American Institute for Manufacturing Photonics (AIM Photonics) installed by former U.S. President Obama, is a manufacturing consortium headquartered in NY, with funding from the US Department of Defense, New York State, California and Massachusetts, and industrial partners to advance the state of the art in the design, manufacture, testing, assembly, and packaging of integrated photonic devices. “Our mission is to create a national institute supporting the end-to-end integrated photonics manufacturing ecosystem in the U.S. by expanding upon a highly successful public-private partnership model with open-access to world-class shared-use resources and capabilities.

Our emphasis is on overall reduction of manufacturing cost and design complexity to reduce the barrier to entry in this” says Michael Liehr. He focuses on the creation of new semiconductor and related industries business opportunities, and is responsible for the effective and efficient operation of the SUNY Poly industrial programs including SUNY Polytechnic Institute’s strategic 300mm advanced CMOS line, integrated photonic semiconductor and 3D packaging and the 150mm SiC power electronics. Continue reading “Towards an end-to-end photonics ecosystem – Interview with Michael Liehr, AIM Photonics”

Photonic Integration Conference welcomes Hamamatsu Photonics as Bronze Partner

Hamamatsu Photonics

Photonic Integration Conference welcomes Hamamatsu Photonics as Bronze Partner. The event takes place on 26 September 2017, High Tech Campus Eindhoven, The Netherlands.

About Hamamatsu Photonics
Hamamatsu Photonics is a worldwide leading manufacturer of opto-electronic components and systems.
Among others we offer sensors and systems for spectroscopy (including ultra fast), scientific-grade cameras, beam monitoring solutions, photon counting detectors and systems, photomultipliers, photodiodes, IR detectors.

Photonic Integration Conference 2017About Photonic Integration Conference 2017
The 3rd edition of the Photonic Integration Conference will take place on September 26, 2017 at High Tech Campus Eindhoven, The Netherlands.

This edition will focus on business models for applying photonic integration, cases of photonic integration in optical sensing, lighting & energy, IT and telecom – current situation and future prospects. Continue reading “Photonic Integration Conference welcomes Hamamatsu Photonics as Bronze Partner”

Compression molding technology for packaging of photonic devices – Presented by Huub Claassen, Towa

Huub Claassen

Huub Claassen, Towa, will talk about “Large scale optical and electrical packaging of photonic devices by using transfer and/or compression molding technology. A possibility to reduce cost”, at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.

The traditional technology for chip encapsulation is Transfer Molding. However, with this technology packaging on Wafer level, very thin BGA and large area size MAP substrates was problematic, Therefore Compression Molding has been developed by the TOWA Corporation of Japan. This method can perform resin flow-free molding by using a granular or liquid type of molding compound.

For both transfer and compression molding processes, fully automatic equipment is available.

In this presentation we would like to explain both molding methods in some detail. The packaging of photonic devices with these methods, to reduce cost, should be possible. Continue reading “Compression molding technology for packaging of photonic devices – Presented by Huub Claassen, Towa”

Big tech companies would do wise to follow developments in photonics closely – Interview with Dan Holladay, BRIDG

Dan Holladay

Big tech companies would do wise to follow developments in photonics closely – Interview with Dan Holladay, BRIDG

Dan Holladay is executive director of operations and technology programs at BRIDG, an open innovation platform for the semiconductor industry based in the US. Last year he signed a partnership with PhotonDelta in Eindhoven to exchange knowledge, skills and talent in photonics and semiconductor technology.

Holladay has great hope for photonics to bring the world into the ‘terabit era’ when sensors will be infinitely cheaper and higher resolution than they are now. “Think Star Trek or the Jetsons,” he says. “It’s going to be real science fiction.”

On the 26th of September Dan Holladay will speak at the Photonics Integration Conference at High Tech Campus Eindhoven about how innovation platforms can help scale up manufacturing in photonics.

How is photonics going to change technology?
“Photonics will produce new sensor technologies that are needed to enable breakthroughs in fields like robotics, health care, autonomous systems like driverless cars, and food quality. Once photonics devices are integrated and apps are written around them, that’s what’s really going to grow the Internet of Things.” Continue reading “Big tech companies would do wise to follow developments in photonics closely – Interview with Dan Holladay, BRIDG”