"Who is Commscope and how to use PIC’s in an optical network" – Presented by Willy Rietveld, Commscope

On the 28th of August 2015 CommScope Holding Company, Inc. has completed its acquisition of TE Connectivity’s Telecom, Enterprise and Wireless businesses, a leader in fiber optic connectivity for wireline and wireless networks.  The all-cash transaction, valued at approximately $3 billion, strengthens CommScope’s position as a leading communications infrastructure provider with deeper resources to meet the world’s growing demand for network bandwidth.  This transaction creates a stronger company with greater innovation, employee talent and overall capabilities to serve customers in four major areas: 1) Indoor and outdoor wireless networks, 2) Data centers and central offices, 3) Connected and efficient buildings and 4) Access and backhaul networks. Commscope is now actively developing PIC’s for the next generation of optical networks.

About Willy Rietveld Continue reading “"Who is Commscope and how to use PIC’s in an optical network" – Presented by Willy Rietveld, Commscope”

"The Coming of Age of Photonic Integrated Circuit Technology" – Presented by Michael Wale, Oclaro Technology

Photonic Integrated Circuit (PIC) technology has evolved over more than 30 years to become a key enabler for high-performance optical communications systems, which form the backbone of the internet and thereby underpin our information-intensive world.

PICs can also be an enabler for new and diverse business sectors, including medical, industrial and aerospace applications.

Major progress has been achieved over the last few years in the development of generic platform-based design and manufacturing methods, which will facilitate the use of PICs in new applications and stimulate innovative product design.

The talk will review the current state of the art.

About Prof. Michael J. Wale Continue reading “"The Coming of Age of Photonic Integrated Circuit Technology" – Presented by Michael Wale, Oclaro Technology”

"JePPIX: Low cost access to PIC technology for SMEs" – Presented by Katarzyna Ławniczuk, TU/e – JePPIX

Development of photonic ICs from application idea through simulation, design using advanced PDK tools, till fabrication and packaging is entirely enabled by JePPIX (Joint European Platform for Photonic Integration Components and Circuits) and enabled at low costs for SMEs, but also for large companies and research institutes. This is thanks to applied generic integration model that separates photonic IC application development from technology aspects, and thus accelerates development of novel photonic-based devices.

About Katarzyna Ławniczuk Continue reading “"JePPIX: Low cost access to PIC technology for SMEs" – Presented by Katarzyna Ławniczuk, TU/e – JePPIX”

"Photonics at TU/e" – Presented by Frank Baaijens, Eindhoven University of Technology

Prof. Dr. Ir. Frank Baaijens, Rector Magnificus, Eindhoven University of Technology, will speak about “Photonics at TU/e” during the Photonic Integration Symposium, which will take place on April 25, at Eindhoven University of Technology, Blauwe Zaal, in Eindhoven, The Netherlands.

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"Ultra-wide super continuum generation in Si3N4/SiO2 waveguides" – Presented by Peter van der Slot, University of Twente

The TriPleX™ integrated optical waveguide platform based on Si3N4 embedded in SiO2 offers medium to high index contrast waveguides with extremely low losses. The extreme low loss combined with the large transparency window, from 400 nm (blue) to 2350 (mid-infrared), and its compatibility with microfluidics makes this platform of high interest for numerous applications ranging from telecom to lab-on-a-chip. On-chip frequency conversion is possible by exploiting the nonlinear susceptibility of the waveguide and would greatly advance the application of integrated photonics. Here we demonstrate ultra-wide supercontinuum generation with a bandwidth of almost 500 THz in dispersion-engineered Si3N4/SiO2 waveguides. Continue reading “"Ultra-wide super continuum generation in Si3N4/SiO2 waveguides" – Presented by Peter van der Slot, University of Twente”

"Photonic integration developments in China" – Presented by Sailing He, Zhejiang University

Recent progresses in the fields of silicon photonics, graphene photonics, nanoplasmonics are reviewed with some research highlights on wavelength/mode (de)multiplexing devices, optical switches, micro-cavities and transparent electrodes, etc. Besides photonic integration research in Mainland China, some national and international research fundings/programs supported by the government of China will also be discussed.

About Sailing He Continue reading “"Photonic integration developments in China" – Presented by Sailing He, Zhejiang University”

"Integrated photonics with the TriPleX platform" – Presented by René Heideman, LioniX

TriPleX is a versatile dielectric platform based on alternating Si3N4 and SiO2 layers, fabricated with CMOS compatible equipment. TriPleX waveguides are very low loss over a wide wavelength range (400 nm-2.35 μm) available in several commercialized geometries. The functionality of the TriPleX platform is captured by verified basic building blocks. The corresponding library and associated design kit is available for Multi Project Wafer (MPW) runs. Higher integration levels and hybrid combinations with other commercially available platforms such as InP and SOI is possible through on-chip, low-loss spotsize convertors.

Especially the hybrid combination with InP yields very powerful additional components like integrated small bandwidth lasers, tunable over the whole C-band. Several examples of applications will be provided.

About René Heideman Continue reading “"Integrated photonics with the TriPleX platform" – Presented by René Heideman, LioniX”