The cost of photonic components is dominated by assembly and packaging processes. This is a drag on adoption at a time when rapid global scaling of connectivity is required. To break this chicken and the egg problem, a fast, flexible, accurate and cost-effective solution for automated photonic-component assembly has been needed.Continue reading “Photonic component assembly systems suitable for every business case”
There are highest demands on accuracy of bonding flipchips e.g. on glass substrates to achieve maximum coupling efficiency, which are a challenge likewise for the machine supplier and the process developer. This presentation focuses on machine solutions to provide best possible machine capability but also points towards important aspects to turn this into an appropriate process capability. The FINEPLACER® principle is explained and how this is improved to reach a placement accuracy of 0.3 µm @ 3s.Continue reading “Highly accurate flipchip bonding for transceiver applications”
Since the first laser diodes and single-mode optical fibers of the early 1990s, the high cost and labor-intensiveness of testing and assembling photonic components have impacted production economics and impeded scaling. With the advent of Silicon Photonics and today’s complex, multi-channel devices, and anticipating adoption of photonics into major new applications fields outside the data center, the newest approaches to improving manufacturing efficiency and yield are seeing high demand.Continue reading “Addressing the high cost of photonic test and assembly through technology and partnerships”
Unlike mainly silicon-based electronics, photonic integration is characterized on one hand by a large diversity of material platforms used (Si, SiN, InP, GaAs, polymers) and on the other hand by wavelengths ranging from UV to the far infrared. In view of the difficulties to establish common, standardized platforms, heterogeneous integration continues to be a key element to drive new technologies and scientific advances for the next decade. The combination of heterogeneous functionalities with optical, thermal, electrical, fluidic, mechanical, and high frequency characteristics requires specialized materials and system integration (packaging and assembly) processes and equipment.Continue reading “Photonic multi-domain integration trends”
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Peter Harmsma, program manager at CITC will be the moderator of the 2021 edition of the Photonic Integration Conference. Peter has a background in integrated photonics. He is a senior scientist at TNO with special interest in photonic sensing, and currently acts as program manager photonic packaging at CITC.Continue reading “Future photonic chip modules will look a lot like todays electronic chip packages”
Advanced packaging of integrated photonic devices based on semiconductor assembly methods. The presentation describes methods for high density flip chip IO, approaches for improved RF performance and assembly packaging in large volumes.Continue reading “Advanced packaging and assembly of Integrated Photonic devices”
Chip Integration Technology Center (CITC) becomes partner of the Photonic Integration Conference 2021
CITC is a non-proﬁt joint innovation center that specializes in heterogeneous integration and advanced chip packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.Continue reading “Chip Integration Technology Center Becomes Partner of Photonic Integration Conference”
Photonic integrated circuits are playing a key role in various next generation sensing and telecommunication applications. Packaging of such chips has become the bottleneck of their integration and deployment. A novel platform based on poylmer waveguides integrated with electrical PCBs is presented, which allows to simultaneously interface photonic chips electrically and optically at high port-densities. Design rules and examples of this novel chip-packaging platform are discussed and showcased.Continue reading “Electro-Optic Circuit Boards – an advanced photonic chip packaging platform”
Photonic Integration Conference welcomes Electro Optics as Media Partner. The conference takes place on September 29, 2021, during Photonics Applications Week.
About Electro Optics
Electro Optics is the leading resource for engineers involved in photonics business, technology and applications. Registered readers will have access to news of the latest technological developments, trends and opinions in the photonics industry as well as independent, in-depth editorial content. Electro Optics provides uncompromised, informed commentary and analysis on topics of interest to anyone involved in the photonics industry. Published 10 times per year, Electro Optics is available worldwide in print (free for qualified readers) or digital (free to all) formats.Continue reading “Photonic Integration Conference welcomes Electro Optics as Media Partner”
Photonic Integration Conference welcomes Fibre Systems magazine as Media Partner
About Fibre Systems
Fibre Systems is a trusted information source for the optical communications industry, aimed at component and subsystem vendors; network equipment manufacturers; planners, installers, and systems integrators; as well as operators and end users of fibre-optic networks worldwide.Continue reading “Photonic Integration Conference welcomes Fibre Systems magazine as Media Partner”